ATS-01H-105-C3-R1 Allicdata Electronics
Allicdata Part #:

ATS-01H-105-C3-R1-ND

Manufacturer Part#:

ATS-01H-105-C3-R1

Price: $ 4.75
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X40X9.5MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01H-105-C3-R1 datasheetATS-01H-105-C3-R1 Datasheet/PDF
Quantity: 1000
10 +: $ 4.27959
30 +: $ 4.04187
50 +: $ 3.80419
100 +: $ 3.56643
250 +: $ 3.32867
500 +: $ 3.09091
1000 +: $ 3.03147
Stock 1000Can Ship Immediately
$ 4.75
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 1.772" (45.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.374" (9.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 28.32°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are responsible for dissipating electric energy into the atmosphere. For this purpose, countless types of thermal products are used for generations. From simple metal plates to complex engineering designs, the ability to conduct and dissipate heat has been critical throughout the electronics industry. The ATS-01H-105-C3-R1 Heat Sink is one such product. This article will focus on its application field and working principle.

The ATS-01H-105-C3-R1 is most commonly used with power supplies, electric motors, resistors, and inductors. This versatile device can be used on multiple types of electrical components due to its pliable design and choice of mounting and pad materials. The device itself is constructed of a multi-layered aluminum and copper combination, stacked and milled together to provide excellent cooling and thermal conduction between the layers. This combination of material also allows for a compact design that can be implemented to fit and match different application placements. The ATS-01H-105-C3-R1 also features extended fins, which maximizes the dissipation of high-density heat, as well as spilt grooves that help to bridge the thermal resistance between each piece.

In order for the ATS-01H-105-C3-R1 to work properly, it must be properly mounted or placed. Depending upon the application, this device can be mounted either horizontally or vertically. If the application demands a more reliable and higher performance, the device should always be mounted vertically. Mounting horizotally can have very satisfactory results, but for applications that need to dissipate high amounts of heat, vertical mounting should always be preferred.

The working principle of a heat sink is simple. To operate properly, the device must be able to easily transfer heat from its inner surface to the surrounding environment. This is done using the thermal energy which is released from the device, thus transferring it to the atmosphere that surrounds it. Since the device is made of a combination of aluminum and copper, these two materials have a great affinity for heat. As the device works, the heat is conducted to a fin that is built on the device. The fin then dissipates this heat into the atmosphere which surrounds it. Thanks to a thermal transfer gap, the temperature of the device is kept stable and heat is never trapped within the device itself.

The ATS-01H-105-C3-R1 Heat Sink is a versatile and reliable product which can be used for many electrical applications. With its combination of aluminum and copper, extensive fins, and thermal padding, it can provide excellent thermal transfer performance in all applications. But, most importantly, it must always be mounted either horizontally or vertically to optimize the device’s performance. With its many features and options, the ATS-01H-105-C3-R1 heat sink is the perfect choice for your next electronics project.

The specific data is subject to PDF, and the above content is for reference

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