ATS-01H-123-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.14°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are a simple but very effective way to dissipate unwanted heat from various electronics and components. The ATS-01H-123-C1-R0 is an example of a heat sink that is commonly used in commercial, industrial, and medical applications. This paper will discuss the application fields and working principle of the ATS-01H-123-C1-R0.

Application Fields

The ATS-01H-123-C1-R0 is composed of a graphite-filled aluminum base and a series of individual fin blades mounted to the base. This particular heat sink is designed for use on multiple printed circuit boards (PCBs) in industrial, medical, or military applications. It is also suitable for applications requiring superior cooling performance, due to its high level of fin density. Common application fields include computing, medical imaging, telecom, automotive, wireless, and consumer electronics.

Working Principle

When the ATS-01H-123-C1-R0 is put into use, air is drawn in from outside of the heat sink and forced through the fins. The fins on the graphite-filled aluminum base act as a large heatsink, transferring and dissipating heat away from components and circuit boards on which the heat sink is installed. Hot air is then exhausted through the opening in the back of the heat sink, and the cooler air replaced by fresh air coming in from the outside.This allows for an efficient exchange of heat between the active area of the PCB and the air surrounding the heat sink, by creating convection current with the air. This process ensures that the air surrounding the heat sink is not only cooler, but the capacitor (if installed) on the PCB is also able to stay at an optimum temperature for stable operation. In some cases, additional heat can be dissipated via a fan or other cooling source.

Conclusion

The ATS-01H-123-C1-R0 is an efficient and cost-effective heat sink solution. It is suitable for multiple applications that require superior cooling solutions, including computing, medical imaging, telecom, automotive, wireless, and consumer electronics. Furthermore, its working principle ensures maximum cooling through the efficient exchange of air within the device, and the use of a graphite-filled aluminum base for maximum heat transfer.

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