| Allicdata Part #: | ATS-01H-152-C3-R0-ND |
| Manufacturer Part#: |
ATS-01H-152-C3-R0 |
| Price: | $ 4.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01H-152-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.74787 |
| 30 +: | $ 3.53934 |
| 50 +: | $ 3.33119 |
| 100 +: | $ 3.12304 |
| 250 +: | $ 2.91483 |
| 500 +: | $ 2.70663 |
| 1000 +: | $ 2.65458 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has always been an essential part of well-functioning electronic systems. Heat sinks, such as the ATS-01H-152-C3-R0, are one of the most commonly used thermal control devices in the industry. They offer a compact solution for effectively transferring heat away from sensitive electronic components. This article will discuss the application field and working principle of the ATS-01H-152-C3-R0 thermal - heat sink.
The ATS-01H-152-C3-R0 is a heat dissipation/cooling solution, designed for various applications. Industries such as telecommunications, robotics, instrumentation, and consumer electronics often rely on this device to keep their systems running efficiently. It is designed for use with a wide variety of electronic components, including LED\'s, power transistors, and high-performance CPUs. The combination of a low thermal resistance and a lightweight construction make it an ideal choice for cooling applications in tight spaces, such as in the cramped interiors of mobile phones or robots.
The device is made of aluminum alloy, which is highly resistant to corrosion and conducts heat extremely well. The device also features a low expansion rate and good thermal conductivity, as well as a low cost and lightweight construction. The finned design of the device provides improved thermal efficiency, allowing it to dissipate more heat than other types of heat sinks. The fins are also designed to promote air flow over the heat sink, thus transferring heat more effectively.
In operation, the ATS-01H-152-C3-R0 thermal - heat sink works by transferring heat from the sensitive electronic component to the device\'s fins. The heat is then dissipated through the fins into the surrounding air. The device is designed to provide optimal cooling performance at low fan speeds, saving energy and lowering noise levels. Additionally, the fanless design of the heat sink eliminates the need for active cooling, reducing the risk of component damage due to overheating or vibration.
The ATS-01H-152-C3-R0 thermal - heat sink is an ideal solution for various cooling applications. Its efficient design, lightweight construction, and excellent thermal transfer characteristics make it a great choice for a wide range of electronic components. Furthermore, the device\'s fanless design allows for a quiet operation and energy savings without sacrificing performance.
The specific data is subject to PDF, and the above content is for reference