| Allicdata Part #: | ATS-01H-170-C1-R0-ND |
| Manufacturer Part#: |
ATS-01H-170-C1-R0 |
| Price: | $ 3.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01H-170-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.04353 |
| 30 +: | $ 2.96100 |
| 50 +: | $ 2.79657 |
| 100 +: | $ 2.63208 |
| 250 +: | $ 2.46758 |
| 500 +: | $ 2.38533 |
| 1000 +: | $ 2.13857 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.02°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is important in many applications, from home automation systems to industrial process control. The ATS-01H-170-C1-R0 is a heat sink designed to help manage electronics temperatures in many different applications. This article will provide an overview of the ATS-01H-170-C1-R0\'s application field and working principle.
Application Field
The ATS-01H-170-C1-R0 is a thermal-plane type heat sink that features a zinc-alloy casting and a thermoplastic fin plate. It can be used in a wide range of fields, including consumer electronics, lighting and communication systems, semiconductor assembly, renewable energy, and automotive systems. The design of the heat sink makes it suitable for applications that require a high degree of reliability and dependability.
The ATS-01H-170-C1-R0 is designed to provide superior performance in areas such as cooling, heat dissipation, and cooling efficiency. Its design ensures that there is minimal heat transfer loss due to air convection or radiation. The heat sink also features a light weight—it weighs only 500 gram—which makes it easy to attach on circuit boards and other components.
Working Principle
The ATS-01H-170-C1-R0 operates by dissipating heat from the component it is attached to, which in turn helps reduce the component’s overall temperature. The heat sink utilizes two mechanisms for this purpose. The first is air convection, which involves air being drawn in from the surrounding environment and heated by the component. The heat is then transferred to the fins of the heat sink, which dissipate the heat into the environment. The second mechanism is conduction, which occurs when heat is transferred directly from the component to the heat sink.
The ATS-01H-170-C1-R0 also features an integrated thermal transfer pad that helps further reduce heat transfer loss. This transfer pad is designed to contact the component directly to maximize heat transfer. The overall design of the heat sink ensures maximum effectiveness in heat dissipation, thus helping to keep components running at optimal temperatures.
Conclusion
The ATS-01H-170-C1-R0 is an ideal thermal-plane type heat sink for a variety of applications, such as consumer electronics, lighting and communication systems, semiconductor assembly, renewable energy, and automotive systems. Its design ensures maximum air convection and heat conduction for effective heat dissipation. The heat sink also features an integrated thermal transfer pad for maximum heat transfer. This makes the ATS-01H-170-C1-R0 ideal for applications that require high performance and reliability.
The specific data is subject to PDF, and the above content is for reference