| Allicdata Part #: | ATS-01H-177-C1-R0-ND |
| Manufacturer Part#: |
ATS-01H-177-C1-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01H-177-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.19788 |
| 30 +: | $ 3.11157 |
| 50 +: | $ 2.93857 |
| 100 +: | $ 2.76576 |
| 250 +: | $ 2.59291 |
| 500 +: | $ 2.50647 |
| 1000 +: | $ 2.24717 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.18°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are devices used to dissipate heat from a given component or system. ATS-01H-177-C1-R0 is a type of thermal heat sink. It has a wide range of application fields and working principles that require an understanding in order to properly select and use the heat sink for optimal performance.
Transistor-based components used in the electronic industry generate large amounts of heat that needs to be removed in order to maintain optimal working temperatures. ATS-01H-177-C1-R0 was designed to address this issue, as it is capable of dissipating large amounts of heat from transistors and other components. Its construction incorporates a finned aluminum design, which creates a large surface area to dissipate the heat quickly from the component.
This type of heat sink has a wide range of applications, including computers, automotive electronics, consumer electronics, medical systems, and industrial systems. It is also suitable for use in applications where any solid-state components may need to dissipate heat, such as solenoids, servos, relays, and AC inverters. It is also suitable for use with AC and DC motor controls, as well as with battery-operated circuits.
The working principle of ATS-01H-177-C1-R0 is based on the conduction of heat from the component to the surrounding air. As heat is conducted through the aluminum fins of the heat sink, the air surrounding the component is cooled, thereby dissipating all of the heat in the system. The efficiency of the heat conductance of ATS-01H-177-C1-R0 is enhanced through its use of convection, as it uses the natural airflow of the environment to further dissipate the heat.
The ATS-01H-177-C1-R0 heat sink is also very efficient at managing temperature fluctuations, as its large surface area is able to absorb and distribute excess heat quickly and evenly. The aluminium construction of the heat sink also ensures that it is able to withstand high temperatures without suffering any structural damage.
In conclusion, ATS-01H-177-C1-R0 is an ideal thermal heat sink for a variety of applications in the electronic industry. Its wide range of application fields, efficient convection-based working principles, and aluminium construction all work together to provide an efficient and reliable heat management solution. By selecting the right heat sink for the specific application, these components can ensure optimal performance and safety in the operating environment.
The specific data is subject to PDF, and the above content is for reference