ATS-01H-182-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.48°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal – Heat Sinks are critical for maintaining the optimal temperature of electronic devices. The ATS-01H-182-C1-R0, manufactured by A-Star Electronics Corp., is an advanced thermal – heat sink that uses the latest technology to offer unprecedented performance. This article will discuss the application field and working principle of this product.

Applications

The ATS-01H-182-C1-R0 thermal – heat sink is ideal for use in a wide variety of industrial and consumer electronics applications, including cell phones, tablets, digital cameras, and other handheld devices. It can also be used in high-end gaming consoles and in servers, as well as modern medical and automotive equipment. The ATS-01H-182-C1-R0 is designed for use in applications involving harsh operating conditions, such as those encountered in factories, where it can deliver reliable operation in temperatures ranging from -30°C (-22°F) to as high as 105°C (221°F). The slim, lightweight and robust design of the ATS-01H-182-C1-R0 makes it ideal for embedded and limited-space applications. The thermal – heat sink is also designed to provide high thermal resistance and offers excellent performance at various fan speeds and airflow levels.

Working Principle

The ATS-01H-182-C1-R0 features an advanced design that incorporates high-quality materials and cutting-edge technologies. The core of the thermal – heat sink consists of a copper base plate and a set of aluminum fins which are connected by intricate copper layers. The copper base plate is designed to efficiently transfer the heat generated by the device’s components to the fins, while the fins act as radiators, dissipating the heat out into the surrounding air. The design of the ATS-01H-182-C1-R0 also features a set of heat-conductive pads which make contact with the device’s power components, transferring heat efficiently to the base plate and fins. Additionally, the ATS-01H-182-C1-R0 is designed to work with different fan speeds and airflow levels, offering superior thermal resistance and performance. The thermal – heat sink also features a robust construction which can withstand shock, vibration and extreme temperatures.

Conclusion

The ATS-01H-182-C1-R0 thermal – heat sink, manufactured by A-Star Electronics Corp., is an advanced product designed for rugged industrial and consumer electronics applications. The thermal – heat sink features a slim, lightweight and robust construction which allows it to be used in limited-space applications while providing excellent thermal resistance and performance. The core of the thermal – heat sink consists of a copper base plate and aluminum fins which are connected by intricate copper layers and the product works with different fan speeds and airflow levels. In conclusion, the ATS-01H-182-C1-R0 is an advanced and reliable thermal – heat sink which will ensure optimal temperature for various different applications.

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