| Allicdata Part #: | ATS-01H-192-C1-R0-ND |
| Manufacturer Part#: |
ATS-01H-192-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01H-192-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-01H-192-C1-R0 is an electronic component used to dissipate heat generated by other devices. It is categorized under Thermal - Heat Sinks, and is designed to aid in efficient heat transfer from other electronic components. The ATS-01H-192-C1-R0 has a variety of applications, including liquid-cooled thermal management systems, industrial machinery, computers and mobile devices.
The ATS-01H-192-C1-R0 features an extruded aluminum base plate, which acts as a base for the heat sink. The base plate contains a large number of holes, which allow air to freely flow over the entire surface of the heat sink. The heat sink also features a stacked series of small fins, which act as an additional heat sink to further dissipate heat. The base plate also has a thermal interface material, such as a thermal compound or a thermal pad, which aids in the transfer of heat from the base plate to the heat sink.
The working principle of the ATS-01H-192-C1-R0 is simple. Heat generated by other electronic components is transferred to the base plate, which acts as a heat sink. The heat is then dissipated through the heat sink and the ambient air. As the heat is dissipated, the air flowing over the surface of the heat sink cools the base plate. This process repeats until all of the heat has been dissipated and the temperature of the base plate returns to an acceptable level.
The ATS-01H-192-C1-R0 is used to aid in the cooling of other electronic components. It is particularly useful in applications where multiple components are generating large amounts of heat, such as graphics cards, processors, and other computer hardware. It can also be used to cool other components such as power supplies and LED light strips. The ATS-01H-192-C1-R0 is also used for dissipating heat generated by industrial machinery and in liquid-cooling thermal management systems.
The ATS-01H-192-C1-R0 is an efficient thermal management solution for a variety of electronics applications. It is designed to effectively transfer heat away from components while maintaining a low operational temperature. The ATS-01H-192-C1-R0 is easy to install and its base plate makes it suitable for a wide range of applications. The large number of fins enables efficient heat dissipation even at low air speeds, making it an efficient thermal management solution.
The specific data is subject to PDF, and the above content is for reference