| Allicdata Part #: | ATS-01H-195-C1-R0-ND |
| Manufacturer Part#: |
ATS-01H-195-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01H-195-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.88°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management has grown in importance as electronic systems get smaller and more complex. Heat sinks, which are common components of thermal management systems, serve a critical role in the transfer of energy away from heat-generating components. The ATS-01H-195-C1-R0 Thermal-Heat Sink is designed to handle a wide range of high watt-density components in many applications.
The ATS-01H-195-C1-R0 Thermal-Heat Sink is a compact, low-profile design that offers reliable thermal protection. It features an aluminum body with a high-thermal conductivity and a copper heat spreader plate. The heat spreader plate is integrated into the aluminum body so that the entire package can be mounted onto a PCB, eliminating the need for additional mounting hardware. The ATS-01H-195-C1-R0 Thermal-Heat Sink offers a wide range of features, including:
- High-performance aluminum extrusion body with heat spreader plate
- Integrated heat spreader plate eliminates the need for additional mounting hardware
- Compact, low-profile design offers reliable thermal protection
- Designed to handle a variety of high watt-density components
- Unique mounting system ensures secure installation
The ATS-01H-195-C1-R0 Thermal-Heat Sink is an ideal choice for a variety of applications, including industrial and consumer electronics, automotive, medical, and aerospace. It is suitable for use in high-power electronic components such as CPUs, FPGAs, graphics cards, and Solid State Drives (SSD). The ATS-01H-195-C1-R0 Thermal-Heat Sink is also able to efficiently dissipate heat from components with maximum current requirements of up to 100W.
The ATS-01H-195-C1-R0 Thermal-Heat Sink works by transferring heat from the component to the heat sink. Heat is conducted through the aluminum body and the integrated copper heat spreader plate. These components act as a heat transfer path, dissipating the heat generated by the component away from the PCB and into the ambient space. The heat sink also features a unique mounting system that ensures secure installation and prevents any movement or vibration of the heat sink assembly.
The ATS-01H-195-C1-R0 Thermal-Heat Sink is designed and manufactured to meet the exacting requirements of today’s high-power components. Its robust construction and efficient heat transfer capabilities make it an ideal solution for many applications. In addition, its low-profile design helps conserve valuable PCB space, making it suitable for a broad range of thermal management applications.
The specific data is subject to PDF, and the above content is for reference