| Allicdata Part #: | ATS-01H-53-C1-R0-ND |
| Manufacturer Part#: |
ATS-01H-53-C1-R0 |
| Price: | $ 3.79 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01H-53-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.44736 |
| 30 +: | $ 3.35433 |
| 50 +: | $ 3.16802 |
| 100 +: | $ 2.98166 |
| 250 +: | $ 2.79531 |
| 500 +: | $ 2.70213 |
| 1000 +: | $ 2.42260 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are typically utilized to reduce the temperature of hot device components and are necessary for applications in industries such as automotive, semiconductor, and aerospace. As machine designs and components get smaller, their combined power requirements increase, resulting in higher surface temperatures that must be dissipated. Most solutions rely on heat sinks, which pull heat away from sensitive components and dissipate it to the outside environment, to reduce temperatures and keep components operating under temperatures that are safe range.
The ATS-01H-53-C1-R0 Heat Sink is a small, lightweight, lightweight heat sink designed for use in applications that require improved thermal performance. It is designed for surface-mount applications and for printed circuit board (PCB) assembly. This type of heat sink is made of copper, which is a high-thermal-conductivity material. Copper is able to transfer heat more efficiently than aluminum due to its low thermal resistance. In addition, this heat sink is also designed to allow for easy attachment to a PCB or other device.
When it comes to its applications, the ATS-01H-53-C1-R0 is ideal for automotive, industrial, and domestic applications where thermal protection of components is required. It can be used for providing cooling of power semiconductors, power modules, and related components. It also provides efficient heat dissipation from planar components such as LCDs. This heat sink is also suitable for cooling of microcircuits, controllers, and other consumer electronics.
In terms of its working principle, the ATS-01H-53-C1-R0 Heat Sink works by dissipating the heat generated from the component that is being cooled. It has a unique fin design which allows air to flow freely around the heat sink and across its body. As air passes through the fins, it is able to transfer heat away from the component and dissipate it into the environment. The copper material used in the construction of the heat sink also helps to maximize thermal conductivity, thereby improving the cooling performance of the heat sink.
The ATS-01H-53-C1-R0 Heat Sink is a reliable, efficient, and cost-effective solution for reducing temperatures of components and keeping them operating safely. Its size and weight make it ideal for applications where space and weight are restrictions. In addition, its copper construction ensures maximum thermal conductivity and improved cooling performance. This heat sink is perfect for a variety of automotive, industrial, and domestic applications.
The specific data is subject to PDF, and the above content is for reference