| Allicdata Part #: | ATS-01H-60-C3-R0-ND |
| Manufacturer Part#: |
ATS-01H-60-C3-R0 |
| Price: | $ 4.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01H-60-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.95577 |
| 30 +: | $ 3.73611 |
| 50 +: | $ 3.51628 |
| 100 +: | $ 3.29654 |
| 250 +: | $ 3.07677 |
| 500 +: | $ 2.85700 |
| 1000 +: | $ 2.80206 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are commonly used in many devices, such as computers, power supplies, and electronic circuits, to help dissipate heat generated by electronic components and avoid damage caused by overheating. Among them, ATS-01H-60-C3-R0 is a type of heat sink with excellent performance.
The ATS-01H-60-C3-R0 heat sink is made of aluminum. It adopts convenient quick-transmission technology, which significantly improves the efficiency of heat dissipation. The length of the heat sink is 60mm, the width is 40mm, the height is 16mm, and the net weight is 5.15g. The heat sink has walls that are bent inward to increase the heat dissipation area and thermal efficiency. The cooling fins have a large surface area and small ventilation spaces, and a large number of parallel channels divert the airflow, drawing away heat quickly. In addition, the standoffs are included, making it easier and faster to install in the device.
Designed for dissipating heat from high-powered semiconductor and power devices, the ATS-01H-60-C3-R0 is one of the best thermal-management solutions currently available. It offers a variety of efficient thermal-management solutions that are both reliable and cost effective. It is suitable for applications such as power supplies, computer peripherals, and other high-density electronic components, and it is an ideal choice for high-end thermal-management solutions.
The working principle of ATS-01H-60-C3-R0 is simple. When an electronic device generates heat, the heat will be absorbed by the heat sink and dissipated into the environment through heat conduction and convection. Heat sinks are designed to absorb and dissipate heat from sensitive components and reduce their operating temperatures. Heat sinks are designed with various shapes, sizes, and materials to match different types of equipment, ensuring efficient heat dissipation while extending the life of the device.
The ATS-01H-60-C3-R0 is a superior choice for thermal-management solutions. Its excellent performance and reliable design make it an ideal choice for various applications. With its innovative design, reliable performance, and cost-effective pricing, the ATS-01H-60-C3-R0 is the perfect solution for any thermal-management needs.
The specific data is subject to PDF, and the above content is for reference