| Allicdata Part #: | ATS-01H-72-C3-R0-ND |
| Manufacturer Part#: |
ATS-01H-72-C3-R0 |
| Price: | $ 5.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01H-72-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.63806 |
| 30 +: | $ 4.38060 |
| 50 +: | $ 4.12297 |
| 100 +: | $ 3.86524 |
| 250 +: | $ 3.60755 |
| 500 +: | $ 3.34987 |
| 1000 +: | $ 3.28546 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat sinks are a part of many electronic devices that rely on convection, conduction, or radiation to dissipate heat away from the device. The ATS-01H-72-C3-R0 is a thermoelectric cooling module that uses a thermoelectric effect to reduce heat from electronic devices. The ATS-01H-72-C3-R0 is a two-stage heat sink with a large base for maximum cooling area and a stacked design for maximum heat dissipation. This module is designed for applications requiring rapid cooling with low thermal resistance.
The ATS-01H-72-C3-R0 utilizes a thermoelectric effect to cool. This effect, also known as the Peltier effect, exploits the fact that when a current is passed through a junction of two dissimilar metals, a heat exchange takes place. By using an alternating current, heat can be exchanged between two metallic surfaces, either a hot side and a cold side. The heat exchange takes place at the interface of the two metallic surfaces and is known as the Peltier-Seebeck effect. The thermoelectric cooling module takes advantage of this effect by sandwiching a metal (typically copper) between two other insulating materials. One side of the metal is cooled by a circulating coolant, while the other side is heated by a heat source, such as a CPU or LED.
The ATS-01H-72-C3-R0 is designed to provide high cooling performance in small areas. It features a large base that provides maximum cooling area and a stacked design for maximum heat dissipation. Its compact size enables easy installation and integration into any electronic device. Additionally, the module features a rugged stainless steel shell for durability and a low thermal resistance for improved heat exchange. The module is also designed for easy connection and comes with mounting screws and springs for secure installation.
The ATS-01H-72-C3-R0 is ideal for applications that require rapid cooling with low thermal resistance. It is commonly used in CPUs, power supplies, and other power dissipating electronic components. Additionally, it can be used for applications requiring high heat exchange rates, such as in LED lighting systems. In any application, the ATS-01H-72-C3-R0 provides improved thermal management and reliable operation.
The specific data is subject to PDF, and the above content is for reference