ATS-01H-74-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-01H-74-C1-R0-ND

Manufacturer Part#:

ATS-01H-74-C1-R0

Price: $ 3.17
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X15MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01H-74-C1-R0 datasheetATS-01H-74-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.87721
30 +: $ 2.79909
50 +: $ 2.64361
100 +: $ 2.48812
250 +: $ 2.33264
500 +: $ 2.25488
1000 +: $ 2.02162
Stock 1000Can Ship Immediately
$ 3.17
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 20.28°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is becoming an increasingly important component of many modern industries, such as electronics and energy production. As the demand for higher power and speed increases, the need for efficient and reliable cooling solutions also increases. Heat sinks are a key component in managing heat generated by electronic components, such as processors and GPUs. The ATS-01H-74-C1-R0 heat sink is specifically designed to provide efficient, reliable cooling for a wide range of electronic components.

Design and Construction

The ATS-01H-74-C1-R0 is a high-performance heat sink constructed of high-quality, low-thermal resistance aluminum. The aluminum is machined to precise specifications, resulting in a seamless, unified aluminum fin array. The fins are arranged in a staggered pattern to maximize the surface area and heat dissipation. The ATS-01H-74-C1-R0 also features an integrated anti-vibration isolator system, designed to reduce vibrations and ensure maximum cooling efficiency. Additionally, the ATS-01H-74-C1-R0 has an integrated heat pipe technology to further increase cooling performance.

Applications and Benefits

The ATS-01H-74-C1-R0 is suitable for a wide range of applications, including but not limited to processors, GPUs, and other high-heat generating electronics. The ATS-01H-74-C1-R0’s effective thermal management ensures reduced power consumption and longer component lifespans, making it suitable for industrial and commercial applications. Additionally, the ATS-01H-74-C1-R0 is easy to install, meaning it can be quickly and easily incorporated into existing systems.

Working Principle

The ATS-01H-74-C1-R0 uses a combination of heat sink and heat pipe technology to dissipate heat from high-power components. Heat is generated in the component and conducted through the heat sink fins to area of lower temperature. The heat is then re-directed, utilizing the integrated heat pipe technology, to a larger area with greater cooling potential. This two-pronged approach ensures maximum thermal efficiency and cooling power.

Conclusion

The ATS-01H-74-C1-R0 is a high-performance thermal management solution, specifically designed for use with high-powered electronics. Its robust construction and integrated anti-vibration isolator provide reliable and efficient cooling, while the integrated heat pipe technology redistributes heat away from the components for further cooling potential. The ATS-01H-74-C1-R0 is suitable for use in a variety of industrial and commercial applications, and is easy to install and maintain.

The specific data is subject to PDF, and the above content is for reference

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