ATS-02A-148-C1-R0

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Heat sinks are devices used to transfer heat away from one place in an electronic circuit to another, typically from one component to another. Thermal management is a critical component of successful high-end applications, as high levels of heat are associated with high-speed devices and hot-sinked components. The ATS-02A-148-C1-R0 is a high-performance heat sink designed for applications that require superior thermal performance.

The ATS-02A-148-C1-R0 is a unique device consisting of an additive-laminate fin array structure containing exposed pin fins, which assists with heat transfer and aids with the cooling efficiency of the sink. This design allows for a larger contact surface with the components, providing improved heat dissipation from the component to the surrounding atmosphere. The design of the ATS-02A-148-C1-R0 also allows for low flow resistance, so that a higher volume of air is supplied to the component, cooling it more efficiently.

The ATS-02A-148-C1-R0 is designed to provide superior thermal performance in a variety of applications, including high-end data centers, IT systems, medical devices, telecommunications, and other devices that require low noise and heat dissipation. Additionally, the ATS-02A-148-C1-R0 is designed for applications where size, weight, and mass considerations are important. The device is capable of operating at temperatures between -40°C and +85°C, and is available with flanges for attaching the sink to other components or surfaces.

The ATS-02A-148-C1-R0 is designed uses a two-stage heat transfer process, which consists of a base layer withadditive-laminate fins that contact the components and transfer heat to the pin fins, and then to the HEA fins which further dissipate heat. The pin fins feature a large contact surface, allowing for an even distribution of the component’s heat. Additionally, the fin array structure is designed to provide improved airflow and cooling, while maintaining low flow resistance. The device is also designed to reduce noise levels, which can be an issue in many high-performance applications.

The ATS-02A-148-C1-R0 is designed to provide superior performance in high-end applications and is suitable for a wide range of applications, including data centers, IT systems, medical devices, and telecommunications. The device is compact, lightweight, and designed for low noise and high thermal performance. The fin array structure of the device is designed to allow for improved heat transfer and improved cooling efficiency. Additionally, the device is designed to reduce flow resistance and noise levels, allowing for an even distribution of the component’s heat and a quieter system. The ATS-02A-148-C1-R0 is an ideal solution for any application that requires high performance and superior thermal management.

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