| Allicdata Part #: | ATS-02A-151-C1-R0-ND |
| Manufacturer Part#: |
ATS-02A-151-C1-R0 |
| Price: | $ 3.70 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02A-151-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.36420 |
| 30 +: | $ 3.27348 |
| 50 +: | $ 3.09154 |
| 100 +: | $ 2.90972 |
| 250 +: | $ 2.72785 |
| 500 +: | $ 2.63691 |
| 1000 +: | $ 2.36412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are essential for the prevention of electronic components from failure due to overheating. ATS-02A-151-C1-R0 is a type of thermal-heat sink manufactured by CPC, Ltd that is designed for larger components such as power transistors, and is used for products such as amplifiers, power supplies, and communication equipment that need extra cooling for heavy-duty applications. It is made of aluminum and has a black anodized finish.
The ATS-02A-151-C1-R0 is designed to draw heat away from electronic components to prevent them from becoming damaged or malfunctioning due to overheating. It does this through the use of convection, which is the transfer of heat by the circulation of air. Hot air rises through the fins and is replaced by cooler air at the bottom, dissipating heat away from the electronic components mounted on the heat-sink.
The ATS-02A-151-C1-R0 features an optimized extruded aluminum fin profile with two degrees of clip-on fins to increase the heat exchange efficiency. The surface contact area is designed to achieve maximum exposure to airflow by featuring an exaggerated round profile that reduces the surface tension when air passes over it. This design helps increase the heat transfer effectiveness by creating more turbulence, allowing more air contact with the surface.
The ATS-02A-151-C1-R0 also features an optimized base feature that provides superior thermal conduction thanks to its large surface area. This feature also allows the heat sink to be used in a variety of applications since it can be mounted to several different surface types, such as metal, wood, plastic, and other materials without affecting its performance.
In addition, the ATS-02A-151-C1-R0 features a unique clip-on clip-off feature that allows for easy installation. It is also designed with a self-adhesive backing for additional mounting flexibility. The ATS-02A-151-C1-R0 also features a soldering pad that makes it a suitable choice for soldering applications.
The ATS-02A-151-C1-R0 is a great choice for larger components that require advanced cooling. It features an optimized design that provides superior thermal conduction and heat transfer, making it ideal for applications such as power supplies, amplifiers, and communication equipment. It is also designed with a clip-on clip-off feature and a self-adhesive backing for easy installation, and a soldering pad for soldering applications.
The specific data is subject to PDF, and the above content is for reference