| Allicdata Part #: | ATS-02A-153-C1-R0-ND |
| Manufacturer Part#: |
ATS-02A-153-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02A-153-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat dissipation is an important part of any electronic device design, and ATS-02A-153-C1-R0 is no exception. ATS-02A-153-C1-R0 is a thermal heat sink designed to dissipate heat generated by a range of electronic components and circuits.
The thermal heat sink contains a number of fins made from aluminum or copper that are designed to maximize contact surface area with the air. Heat is applied to one end of the heat sink and dissipated to the other through the fins. The heat sink may also be equipped with fans to further increase air circulation and cooling. The size, shape, and number of fins can all be customized depending on the various criteria for specific applications.
As its name suggests, ATS-02A-153-C1-R0 is designed for use in industrial and commercial applications. It can be used in:
- Supercomputers and server farms
- Industrial sensors and controllers
- Large scale fuel cells
- High voltage power supplies
The design of the ATS-02A-153-C1-R0 thermal heat sink makes it highly effective for a range of applications requiring rapid heat dissipation. As mentioned before, the number and shape of fins is customizable and, hence, the cooling performance can be optimized for different scenarios. As well as this, the fins are well spaced and arranged which helps to channel the air effectively to enhance cooling and reduce the temperature.
The ATS-02A-153-C1-R0 thermal heat sink is also designed to be lightweight and easy to install even in tight spaces. It also comes with a mounting clip which makes it easy to attach to the device\'s chassis. Additionally, the heat sink features an integrated thermal conductivity which helps to further reduce the temperature. This is achieved by providing a higher thermal conductance between the heat sink and the component, so that heat can be efficiently dissipated.
The ATS-02A-153-C1-R0 thermal heat sink is designed to help keep the temperature of electronic devices and components within safe levels to ensure reliable operation. This makes it an ideal choice for a range of applications, from simple consumer electronic devices to more complex industrial and commercial equipment.
The specific data is subject to PDF, and the above content is for reference