| Allicdata Part #: | ATS-02A-17-C3-R0-ND |
| Manufacturer Part#: |
ATS-02A-17-C3-R0 |
| Price: | $ 4.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02A-17-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.80520 |
| 30 +: | $ 3.59415 |
| 50 +: | $ 3.38260 |
| 100 +: | $ 3.17123 |
| 250 +: | $ 2.95982 |
| 500 +: | $ 2.74840 |
| 1000 +: | $ 2.69555 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are electrical components used to dissipate heat from other elements, such as transistors, diodes, semiconductors, and other devices. In electronic circuits, they act as a heat dissipation device, transferring thermal energy from a heat-generating component to ambient air. In some cases, they also act as a passive cooling device by cooling surface elements.
The ATS-02A-17-C3-R0 Heat Sink is designed to be a highly efficient thermal conductor. It is a compact, rugged, and lightweight Metal Alloy thermal solution designed for use in a variety of applications – telecommunication equipment, computers, AV-systems, engineering systems, and automotive electronics.
The primary function of the ATS-02A-17-C3-R0 Heat Sink is to remove heat from elements or systems that produce a high amount of heat. The device works by cooling surfaces, which in turn helps manage temperature and prevent thermal runaway. The heat sink uses a uniform fin pitch and wide spacing to ensure optimum air channeling for efficient heat dissipation.
The ATS-02A-17-C3-R0 Heat Sink has an all-metal construction with superior thermal conductivity. The aluminum material offers superior strength and excellent heat conductivity. The design also features a highly efficient thermal design. This means that the heat generated by components is effectively transferred to the outside surface of the heat sink.
The ATS-02A-17-C3-R0 Heat Sink also has an enhanced performance profile. This is due to its ability to conduct thermal energy more efficiently. The device is designed to efficiently disperse thermal energy, making it ideal for a wide range of applications in areas such as telecommunication, computers, engineering, AV-systems, and automotive. The device can also be used with other heat sink components, such as fans, for a more comprehensive thermal system.
The ATS-02A-17-C3-R0 Heat Sink is a simple, reliable, and cost-effective solution for dissipating heat from electronic components. The device has a superior heat dissipation capacity, making it an ideal choice for a range of applications and industries, including telecommunication equipment, computers, engineering systems, AV-systems and automotive. Thanks to its lightweight and rugged design, it can handle extreme temperatures and ensure reliable, long-term performance.
The specific data is subject to PDF, and the above content is for reference