| Allicdata Part #: | ATS4333-ND |
| Manufacturer Part#: |
ATS-02A-19-C2-R0 |
| Price: | $ 4.80 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02A-19-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.36590 |
| 10 +: | $ 4.24494 |
| 25 +: | $ 4.00907 |
| 50 +: | $ 3.77332 |
| 100 +: | $ 3.53751 |
| 250 +: | $ 3.30168 |
| 500 +: | $ 3.06585 |
| 1000 +: | $ 3.00689 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.77°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks have been an important part of the electronics industry since the 1990s, and ATS-02A-19-C2-R0 Thermal Heat Sink is one of the most commonly used devices. It is designed to help dissipate the heat from electrical components, thus providing an efficient transfer of heat away from the component or device.
ATS-02A-19-C2-R0 Thermal Heat Sink is a single-stage storage which is suitable for applications with thermal gradient no greater than 10 degrees C. It is a passive device which is comprised of a finned aluminum or copper base which is then covered with a high-performance thermal pad. The fins provide maximum heat dissipation in a wide range of environmental conditions. It typically has two mounting points, one at the bottom and one at the top. The top end is usually used for mounting the thermal pad while the bottom end is used for mounting the device.
These types of heat sinks take advantage of the convection process to dissipate heat from electrical components. By using fins on the heat sink, they are able to increase the amount of surface area that hot air is exposed to, which helps to transfer heat away from the component more quickly. The heat is then dissipated into the surrounding environment. The pads on the top of the heat sink also create a tight seal, preventing the hot air from escaping. This allows the device to function more efficiently.
ATS-02A-19-C2-R0 Thermal Heat Sink can be used in a wide range of applications including, but not limited to; computers, chipsets, microprocessors, ASICs, FPUs, GPUs, memory chips, power supplies and other electronic components. It is capable of providing a high level of cooling performance and is able to dissipate up to 10 degrees C of temperature gradient. This makes it an ideal choice for applications where high performance cooling is required.
In addition, ATS-02A-19-C2-R0 Thermal Heat Sink is also an efficient device for controlling thermal behavior in high power applications. As the device works by increasing the amount of surface area available for heat dissipation, it can also regulate the amount of heat that is generated by the components, therefore allowing the component or device to operate in an optimal temperature range.
In summary, ATS-02A-19-C2-R0 Thermal Heat Sink is a reliable and efficient device for dissipating heat away from electronic components. It is also capable of controlling the thermal behavior in high power applications and is a popular solution for a wide range of applications. As such, it is a highly versatile heat sink which can be used in a wide range of applications requiring efficient thermal management.
The specific data is subject to PDF, and the above content is for reference