ATS-02A-24-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.362" (60.00mm)
Width:	2.362" (60.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.37°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sink Applications and Working Principles of ATS-02A-24-C2-R0

Thermal - Heat Sinks are an integral component for any electronic device. They help in dissipating heat to maintain an optimal temperature. There are a wide variety of heat sinks available in the market, each suitable for different needs. The ATS-02A-24-C2-R0 is a type of thermal - heat sink, which is designed for use in applications where low thermal resistance is critical.The ATS-02A-24-C2-R0 is a compact thermal - heat sink made of aluminum with a 12-inch base height. It has a black anodized finish, with fins that are designed to increase surface area for improved heat dissipation. The base is profiled for maximum thermal performance, while the fin is designed for optimal airflow. With its design and construction, the ATS-02A-24-C2-R0 offers superior heat dissipation capabilities compared to other thermal - heat sinks.The ATS-02A-24-C2-R0 is designed to be used in applications that require low thermal resistance. It can be used to dissipate heat from components such as processors, chipsets, and other integrated circuits. The aluminum fins help dissipate the heat to the surrounding air, while the base of the heat sink helps dissipate the heat to the underlying board. The profiled design ensures that the heat is evenly distributed throughout the sink for consistent thermal performance.The working principle of the ATS-02A-24-C2-R0 is relatively simple. Heat is transferred from the component to the aluminum fins, where it is dissipated into the air. The heat is then transferred from the base of the heat sink to the underlying board, where it can then be dissipated as well. The profiled design ensures that the heat is evenly distributed throughout the heat sink, ensuring optimal thermal performance.In applications that require low thermal resistance, the ATS-02A-24-C2-R0 can provide superior thermal performance. Its low thermal resistance and optimal fin design enable it to be used for components such as processors, chipsets, and other integrated circuits. The anodized finish and profiled base provide extra thermal dissipation capabilities, while the fins are engineered to ensure maximum airflow and minimize thermal resistance. With its superior thermal performance and construction, the ATS-02A-24-C2-R0 can be used in any application that requires low thermal resistance.

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