| Allicdata Part #: | ATS-02A-36-C2-R0-ND |
| Manufacturer Part#: |
ATS-02A-36-C2-R0 |
| Price: | $ 5.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02A-36-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.23971 |
| 30 +: | $ 4.94865 |
| 50 +: | $ 4.65759 |
| 100 +: | $ 4.36647 |
| 250 +: | $ 4.07537 |
| 500 +: | $ 3.78427 |
| 1000 +: | $ 3.71150 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sink is a device that is used to dissipate heat from a component or system over a larger area for the purpose of decreasing its temperature. The ATS-02A-36-C2-R0 is a Heat Sink with a maximum length of 102mm which is suitable for use with various electronic components and systems. It has two sides which are made of high thermal conductivity material; one side is finished in black and the other is silver colored. The thermal design of this heat sink is based on a heat-pipe principle which makes it highly effective in controlling heat and providing better heat dissipation.
With a heat-pipe principle, the ATS-02A-36-C2-R0\'s working principle is to move heat quickly away from the device, controlling its temperature. Heat is transferred from the device to the material of the heat sink, due to the thermal conductivity of the material. The heat is then moved through the heat-pipe structure from one side of the heat sink to the other side, where it can be dissipated from the surroundings into the ambient air. This enables better control of the device’s temperature and longer life span of the heat sink itself.
The ATS-02A-36-C2-R0 heat sink is designed for use in a variety of applications. As it provides better dissipation than traditional heat sinks, it is commonly used for cooling high-power components such as CPUs and GPUs, as well as for LEDs and power amplifiers. Additionally, it is suited for use in a range of industrial applications, where rapid heat dissipation is important. Such applications include laser systems, 3D printers, medical equipment, and aerospace applications.
In summary, the ATS-02A-36-C2-R0 is a thermal form heat sink with a maximum length of 102mm. Its thermal design is based on a heat-pipe principle, which makes it highly effective in controlling temperature and providing optimal heat dissipation from the device. It is suitable for use in a variety of applications, including cooling high-power components, 3D printing, and industrial equipment.
The specific data is subject to PDF, and the above content is for reference