| Allicdata Part #: | ATS-02A-37-C2-R0-ND |
| Manufacturer Part#: |
ATS-02A-37-C2-R0 |
| Price: | $ 5.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X17.78MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02A-37-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.39028 |
| 30 +: | $ 5.09061 |
| 50 +: | $ 4.79128 |
| 100 +: | $ 4.49177 |
| 250 +: | $ 4.19232 |
| 500 +: | $ 3.89287 |
| 1000 +: | $ 3.81801 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.12°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management in electronic components is an important field of study. Heat generated by the components must be dissipated and removed away from the enclosure or else the components will be damaged or even destroyed. Heat sinks are one of the most popular methods of thermal management used today. Heat sinks are designed to disperse heat generated by electronic components across large surface areas that typically require cooling fans to facilitate the process. ATS-02A-37-C2-R0 heat sink is a popular thermal management product that is used in a wide variety of applications.
The ATS-02A-37-C2-R0 heat sink is designed to provide efficient cooling of electronic components. The heat sink is made up of two pieces; the base and the cover. The base of the ATS-02A-37-C2-R0 is constructed from aluminum with a dielectric coating that helps to dissipate heat away from the component. The cover of the ATS-02A-37-C2-R0 is made of copper and is designed to facilitate the transfer of heat away from the component and into the atmosphere. The ATS-02A-37-C2-R0 also contains a series of fins along the sides of the heat sink that further facilitates cooling by creating more surface area to dissipate heat into the atmosphere.
The ATS-02A-37-C2-R0 heat sink is designed to provide efficient cooling of electronic components in a variety of applications. The heat sink can be used for power supplies, amplifiers, motor drives, and other applications that require cooling of hot electronic components. The heat sink is designed to provide effective cooling while using minimal energy and can be used in applications that require reliable performance over long periods of time. The ATS-02A-37-C2-R0 heat sink is also designed to be simple and easy to install, making it an ideal choice for those who are looking for a quick and easy solution to their thermal management needs.
The ATS-02A-37-C2-R0 heat sink operates using a simple principle. As the component generates heat, the heat is transferred to the base of the heat sink. The dielectric coating on the base of the heat sink helps to dissipate the heat into the surrounding air. The copper cover of the heat sink further facilitates the transfer of heat into the atmosphere. The fins of the heat sink also act as additional radiators to increase cooling effectiveness.
In conclusion, the ATS-02A-37-C2-R0 heat sink is a popular thermal management product that is used in a variety of applications. The heat sink is designed to efficiently cool electronic components while using minimal energy. The heat sink is designed to be simple and easy to install, making it an ideal choice for those who need a reliable, quick and easy solution to their thermal management needs.
The specific data is subject to PDF, and the above content is for reference