| Allicdata Part #: | ATS-02A-43-C1-R0-ND |
| Manufacturer Part#: |
ATS-02A-43-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02A-43-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
Specifications
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks is a product that is designed to dissipate large amounts of heat from components, systems or the environment. The ATS-02A-43-C1-R0 is a member of this family of products and is designed to maximize the thermal performance of the components or systems it is attached to. The device contains a wide range of features that allow it to effectively and efficiently dissipate heat, including an integrated heat sink, a sealed enclosure, and a polyethylene foam insulation for added durability and noise reduction.
The ATS-02A-43-C1-R0 is a heat sink designed to be used in the consumer market, such as laptops, cellular phones, tablets, and other consumer electrical and electronic devices. It is most successful when used in applications that require substantial thermal capabilities, such as in electronic device enclosures. Because of its unique design and construction, it is specially suited for use in applications with a large heat output, such as the consumer market.
The ATS-02A-43-C1-R0 works by using the thermal properties of aluminum to dissipate heat. Aluminum is an excellent heat conductor and is able to dissipate a high amount of heat quickly and efficiently. The aluminum heat sink consists of four fin-like protrusions or “fins” which are strategically placed to maximize heat dissipation. The fins are connected to the heat sink with a series of tapered slots that further improve heat dissipation. The air flow through the fins is optimized by an internal fan, which helps to propel the air across the fins and quickly dissipate the heat.
In addition to the aluminum heat sink, the ATS-02A-43-C1-R0 also utilizes a sealed enclosure to further improve its ability to dissipate heat. This enclosure is an insulated, double-walled casing that helps increase air flow and reduce air turbulence. Inside the enclosure, there is also a polyethylene foam insulation, which helps to further reduce turbulence and noise.
The ATS-02A-43-C1-R0 is able to maximize thermal performance due to its combined features. By using a combination of the aluminum heat sink and the sealed enclosure, it is able to effectively dissipate heat from the component or system it is attached to. The aluminum fins are able to quickly dissipate heat away from the component, while the sealed enclosure and the polyethylene foam insulation are able to reduce noise and turbulence. This combination of features makes the ATS-02A-43-C1-R0 an excellent choice for applications that require substantial thermal performance.
The specific data is subject to PDF, and the above content is for reference
Latest Products