| Allicdata Part #: | ATS-02A-63-C3-R0-ND |
| Manufacturer Part#: |
ATS-02A-63-C3-R0 |
| Price: | $ 4.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02A-63-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.78252 |
| 30 +: | $ 3.57231 |
| 50 +: | $ 3.36206 |
| 100 +: | $ 3.15195 |
| 250 +: | $ 2.94182 |
| 500 +: | $ 2.73169 |
| 1000 +: | $ 2.67917 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a technology used to transfer heat away from a single hot spot efficiently. ATS-02A-63-C3-R0 is a type of thermal – heat sinks device designed to extract heat from a wide array of different components, without the need for expensive liquid cooling systems or bulky air-cooled designs.
A thermal – heat sinks device consists of a metal base, either aluminum, steel or copper, a metal finned heat dissipating element, and a thermal – heat sinks to connect the heat source and dissipate the heat. ATS-02A-63-C3-R0 is a typical aluminum fin heat sink modeled by extruded technology for great cooling performance. It consists of fin, aluminum base, and two clips for easy installation. With its clip design, users can easily install the thermal – heat sinks on their components and saw a significant drop in temperature.
The main goal of a thermal – heat sink is to increase the surface area of the hot component and allow slowed or more efficient heat transfer from the component to the heat sink. Heat sinks work by dissipating the heat absorbed by the metal fins away from the component through conduction. The larger surface area allows for improved heat transfer to the ambient air, so the component isn’t subjected to as high of temperatures. ATS-02A-63-C3-R0, with its larger fin surface area and well-designed fin profile, greatly increase the surface area and offer higher cooling performance.
ATS-02A-63-C3-R0 is widely used in electronics, LED lighting and other applications due to its superior thermal performance and easy installation. Its main applications include power amplifiers, DC-DC converters, high power transistors, P-N junction devices and LED lighting for lighting, machine vision and automotive systems.
In general, thanks to its unique design features, such as the fin structure, extrusion technology, and clip design, ATS-02A-63-C3-R0 offers superior performance in the thermal – heat sinks market. It is an ideal choice for various applications, as it has the potential to significantly reduce temperatures and keep components running efficiently and reliably.
The specific data is subject to PDF, and the above content is for reference