| Allicdata Part #: | ATS4432-ND |
| Manufacturer Part#: |
ATS-02B-10-C2-R0 |
| Price: | $ 4.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02B-10-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.80520 |
| 10 +: | $ 3.70125 |
| 25 +: | $ 3.49574 |
| 50 +: | $ 3.29011 |
| 100 +: | $ 3.08448 |
| 250 +: | $ 2.87885 |
| 500 +: | $ 2.67322 |
| 1000 +: | $ 2.62181 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.89°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-02B-10-C2-R0 heat sink is an excellent thermal device for practical applications. It has a wide array of uses and is highly efficient in dissipating heat. This article will explain the application fields and working principles of the ATS-02B-10-C2-R0, giving people an insight into the device and how it works.
The primary application fields of the ATS-02B-10-C2-R0 are computers, communication systems, data centers, and consumer electronics. This model is capable of handling large amounts of heat, and is therefore suitable for applications in high-temperature environments. Additionally, because it has a large surface area, it can be used to dissipate heat from large scale applications, such as data centers, where multiple components generate heat. By providing an efficient heat transfer, it ensures the equipment runs at optimal operational temperatures for optimal performance.
The ATS-02B-10-C2-R0 heat sink works through the principle of convection. When it is mounted over a heat generating component, the heat from the component is conducted through the thermal interface material to the heat sink. Heat will then dissipate from the surface of the heat sink and into the air. The heat sink facilitates the process by allowing for the maximum amount of efficient air-to-surface contact. Additionally, it has fins or ridges which create an even bigger surface area to increase the rate of heat dissipation.
Another key feature of the ATS-02B-10-C2-R0 is its efficient heat transfer. The heat sink has a copper base and aluminum fins with a high-performance thermal gap filler. This ensures efficient conduction of heat from the component to the heat sink. All of this helps to maintain the component\'s optimal operating temperature while reducing power consumption and improving efficiency.
The ATS-02B-10-C2-R0 heat sink is an efficient thermal device capable of dissipating large amounts of heat from high-temperature environments. By utilizing the principles of convection, it efficiently transfers heat from the component to the air, while its large surface area leads to better air-to-surface contact and a more efficient transfer of heat. Additionally, its efficient heat transfer ensures optimal operating temperatures and can help improve efficiency. All of this makes the ATS-02B-10-C2-R0 an excellent thermal device for many practical applications.
The specific data is subject to PDF, and the above content is for reference