| Allicdata Part #: | ATS-02B-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-02B-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02B-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is becoming increasingly important as heat-generating electronic components need to be kept running reliably and safely. Heat sinks are components that are designed to absorb and dissipate heat to allow a cooling device to manage the movement of thermal energy. The ATS-02B-10-C3-R0 is one such heat sink that can be used for these applications and is popular among electronic component manufacturers.
The ATS-02B-10-C3-R0 is a two-piece aluminum alloy heat sink. It is constructed using extruded sections which are then milled to create the desired profile. This heat sink boasts an impressive service temperature range of -40°C to +125°C and a maximum operating temperature of +125°C. It also has good thermal conductivity and a high surface area to volume ratio, which makes it an effective heat dissipator.
The main purpose of this heat sink is to provide a way to efficiently and safely transfer heat away from sensitive electronic components. To do this, the heat sink utilizes convection and radiation to transfer heat from the components to its surface. Once the heat has been transferred to the surface, it can then dissipate into the air. The design of the heat sink allows air to circulate around it, which helps to improve its cooling performance.
The ATS-02B-10-C3-R0 heat sink is ideal for cooling components in a variety of applications. It is often used to cool components in computer enclosures, in home and office appliances, and in portable devices such as smartphones and tablets. It is also used in automotive components where it is more commonly known as a \'cold plate\'. In addition, its compact size makes it suitable for cooling components in industrial applications, where space is limited.
The ATS-02B-10-C3-R0 heat sink is easy to install as it comes pre-drilled, pre-tapped, and with mounting hardware included. To install, the designated mounting holes must be aligned with the thermal interface material and the heat sink itself. Once it is secured, the thermal paste or interface material should be applied to the contact points between the heat sink and the electronic components to create a reliable thermal bond. Proper installation is critical to ensure the best performance of the ATS-02B-10-C3-R0 heat sink.
The ATS-02B-10-C3-R0 is one of the most efficient and reliable heat sinks on the market. Its combination of high performance and low cost makes it an attractive solution for many cooling problems. By using this heat sink, manufacturers can ensure that their components stay safe and reliable, even in the most extreme situations.
The specific data is subject to PDF, and the above content is for reference