| Allicdata Part #: | ATS-02B-115-C1-R0-ND |
| Manufacturer Part#: |
ATS-02B-115-C1-R0 |
| Price: | $ 3.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02B-115-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.93643 |
| 30 +: | $ 2.85705 |
| 50 +: | $ 2.69829 |
| 100 +: | $ 2.53953 |
| 250 +: | $ 2.38085 |
| 500 +: | $ 2.30148 |
| 1000 +: | $ 2.06339 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.31°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices that are used to effectively manage and transfer the heat that is generated by the electronic components. Heat sink devices are commonly used in electronic circuits to cool down the electronic components that tend to generate too much heat. One such device is the ATS-02B-115-C1-R0 Heat Sink.
The ATS-02B-115-C1-R0 Heat Sink is a thermal heat sink that is designed to be used in a variety of applications. It is made up of an aluminum base plate, a cover plate with fins, and a thermally conductive interface material. The aluminum base plate provides a low-resistance thermal path between the device and the heat sink, allowing heat to more efficiently transfer away from the device and into the fins of the cover plate, which dissipate the heat into the surrounding environment. The thermally conductive interface material helps to fill any gaps between the base plate and the cover plate, while also providing a cushion to reduce vibration and minimize the risk of components becoming loose due to thermal mechanical stress.
The ATS-02B-115-C1-R0 is a versatile thermal heat sink that can be used in a variety of applications. It is commonly used in consumer electronics such as televisions and computers, where it can be used to help dissipate the heat generated by components. It can also be used in industrial applications such as high-power LED lighting applications, lasers, amplifiers and power supplies where more efficient heat management is necessary. Additionally, the ATS-02B-115-C1-R0 can be used in high-performance computing, automotive and aerospace applications where the heat generated by the components needs to be efficiently dissipated.
The ATS-02B-115-C1-R0 heat sink is designed to work in tandem with other thermal management components such as fans, cooling fins, etc., in order to achieve optimal cooling and efficient heat dissipation. The placement of the heat sink in relation to other cooling components should be done carefully in order to achieve maximum efficiency. It\'s also important to note that the ATS-02B-115-C1-R0 heat sink should be placed in an environment that has adequate airflow and ventilation, such as in an air-cooled environment (for example, near a fan or an intake source).
The ATS-02B-115-C1-R0 is a reliable and efficient thermal heat sink that can be used in a variety of applications. It is designed to provide efficient heat management and thermal performance, while also reducing noise and vibration due to its thermally conductive interface material. The ATS-02B-115-C1-R0 heat sink is also designed to be easy to install and maintain, making it a great choice for any thermal management application.
The specific data is subject to PDF, and the above content is for reference