| Allicdata Part #: | ATS-02B-12-C3-R0-ND |
| Manufacturer Part#: |
ATS-02B-12-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02B-12-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-02B-12-C3-R0 thermal and heat sink device is a specialized solution for managing the thermal energy from electronic devices. Its performance is based on the principles of thermal transfer technology, which enable it to provide superior cooling for electronic equipment while also minimizing the amount of active cooling needed. By ensuring that the heat produced by the electronic device is safely dispersed, this device can help to increase the efficiency of the overall system while also reducing the risk of system malfunctioning during extended periods of service.
Application Field
The ATS-02B-12-C3-R0 can be applied in a wide range of electronics applications, including data centers, telecom stations, industrial control units, and gaming consoles. This device can also be used in medical environments, laboratory settings, and consumer electronics. The unique design of this thermal and heat sink device ensures that it can be conveniently installed without requiring any complicated tools or special mounting equipment. As it can be easily integrated into confined environments, it is a great choice for projects that require space saving solutions.
Working Principle
The core of the ATS-02B-12-C3-R0 thermal and heat sink device lies in its superior thermal transfer efficiency. By utilizing an advanced aluminum fin design with copper insertions, the device is able to dissipate heat more effectively in comparison to other devices, such as solid plates, floating plates, and bonded plates. As the device is designed to transfer thermal energy more efficiently, it can be used in a wide range of hostile environments. The aluminum fins increase the heat transfer area, while the copper conductive insertions assure that the thermal energy is safely dispersed into the environment.
The ATS-02B-12-C3-R0 includes an array of cooling fins, which are designed to facilitate effective heat dissipation from multiple angles. This ensures that the device can provide superior cooling with minimal energy input. Furthermore, as this device operates at a low noise level, it can be used in any environment without causing any distraction or disruption. In addition, the device features a durable housing that is designed to resist corrosion and can sustain exposure to moisture and dust, so it can be applied in any environmental condition.
The ATS-02B-12-C3-R0 thermal and heat sink is an ideal solution for any application, as it can provide superior cooling with minimal energy input. By utilizing an advanced aluminum fin design and copper insertions, this device is able to disperse heat more effectively compared to other devices. In addition, it is equipped with a durable housing that can withstand exposure to dust and moisture, so it can be used in any environment. With its capacity to provide top-notch cooling performance, this thermal and heat sink device is ideal for any application.
The specific data is subject to PDF, and the above content is for reference