| Allicdata Part #: | ATS-02B-139-C3-R0-ND |
| Manufacturer Part#: |
ATS-02B-139-C3-R0 |
| Price: | $ 3.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02B-139-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.03156 |
| 30 +: | $ 2.94945 |
| 50 +: | $ 2.78573 |
| 100 +: | $ 2.62181 |
| 250 +: | $ 2.45796 |
| 500 +: | $ 2.37602 |
| 1000 +: | $ 2.13022 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important yet often overlooked aspect of electronics engineering. Heat sinks are an essential part of thermal management, and the ATS-02B-139-C3-R0 thermal heat sink is an excellent choice for dissipating large amounts of heat. This article will provide an overview of the application field and working principles of the ATS-02B-139-C3-R0 heat sink.
Introduction to Thermal Heat Sinks
A thermal heat sink is a device used to dissipate heat away from sensitive electronic components. Heat sinks are typically constructed from a combination of metal and thermally conductive material, such as copper or aluminum. The design of the heat sink is critical in determining its thermal performance. Factors such as the number of fins, surface area, orientation, and airflow all contribute to the effectiveness of the heat sink in dissipating heat away from the components.
ATS-02B-139-C3-R0 Heat Sink Overview
The ATS-02B-139-C3-R0 heat sink from Altherm Electronics, Inc. is designed to dissipate thermal energy away from high-power devices, such as CPUs,GPUs, and FPGAs. It features a two-pipe design which provides superior cooling performance. The large number of fins increase surface are, allowing more heat to be dissipated away from the device. The heat sink has a height of 11.7 cm, a width of 11.4 cm, and a depth of 10.2 cm.
The heat sink also features an innovative clip-lock mounting system, which eliminates the need for screws, making installation easy and secure. The ATS-02B-139-C3-R0 is constructed from high-grade aluminum and is anodized for superior corrosion resistance.
Applications of the ATS-02B-139-C3-R0 Heat Sink
The ATS-02B-139-C3-R0 is ideal for dissipating large amounts of thermal energy from CPUs, GPUs, and FPGAs. Its two-pipe design and superior thermal performance make it suitable for high-power applications. It is also excellent for reducing the risk of thermal runaway, which can be detrimental to electrical components.
The heat sink is also a popular choice for overclockers looking to maximize thermal performance. Its versatile mounting system makes it easy to install and remove, and its anodized coating prevents corrosion in high-humidity applications.
Working Principle of the ATS-02B-139-C3-R0 Heat Sink
The ATS-02B-139-C3-R0 heat sink is designed to dissipate heat by transferring it to the air. The metal body and fins of the heat sink absorb heat from the hot component and then transfers it to the surrounding air. Airflow is essential for efficient heat transfer, and the fins of the heat sink provide additional surface area to further dissipate heat.
Airflow is increased by mounting the heat sink onto the component using the clip-lock system. This system creates a tight fit between the heat sink and the component, which increases the efficiency of the heat transfer process. The height of the heat sink also helps to ensure that it is in close contact with the air surrounding it.
Conclusion
The ATS-02B-139-C3-R0 thermal heat sink from Altherm Electronics, Inc. is a versatile and reliable product for dissipating large amounts of heat away from CPUs, GPUs and FPGAs. Its two-pipe design, large number of fins, and innovative clip-lock mounting system all contribute to its high thermal performance. The heat sink is suitable for a variety of applications and is also popular with overclockers looking for superior thermal performance.
The specific data is subject to PDF, and the above content is for reference