ATS-02B-152-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.29°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction
Heat sink technology plays an important role in the thermal management of modern electronic devices. One type of heat sink specifically designed to meet the thermal management needs of very high-temperature applications is the ATS-02B-152-C1-R0. This type of heat sink is designed to offer maximum heat dissipation while minimizing the risk of component damage and failure. In this article, we’ll take a look at the ATS-02B-152-C1-R0, its application fields, and its working principle.

Application Field and Installation
ATS-02B-152-C1-R0 heat sinks are used in a variety of applications, including microprocessors, processors, GPUs, and other high-temperature components used in personal computers, servers, industrial applications, and so on. They are designed for use in conditions where air cooling is not feasible; in other words, where conventional fans are unable to provide enough cooling to keep temperatures below a certain level. Depending on the application, the heat sink may be attached using screws, thermal adhesives, or a combination of methods.

Working Principle
The ATS-02B-152-C1-R0 is designed to provide much more efficient thermal management than conventional fans by using a two-stage cooling process. The first stage of the cooling process is passive, meaning that no power is consumed in this process. This stage involves the heat sink’s base and fins. The base of the heat sink is designed to absorb and dissipate more heat than conventional heat sinks, and its fins are designed to allow more air to flow through them, thus increasing the rate of heat exchange. The active stage of the cooling process is powered, and involves the heat sink’s fan. The fan is designed to move more air through the heat sink’s fins than ordinary fans, resulting in faster cooling of the component and a lower risk of component damage due to overheating.

Conclusion
The ATS-02B-152-C1-R0 heat sink is specifically designed for tasks that require precise thermal management or where higher temperatures could lead to damage or failure. Its two-stage cooling process and its base and fin design result in very efficient heat dissipation, greater air flow, and lower temperatures. Thus, it is an ideal choice for those who need reliable cooling in situations where fan-based cooling is inadequate.

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