ATS-02B-161-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS4500-ND

Manufacturer Part#:

ATS-02B-161-C2-R0

Price: $ 4.69
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X20MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02B-161-C2-R0 datasheetATS-02B-161-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.25880
10 +: $ 4.14099
25 +: $ 3.91079
50 +: $ 3.68084
100 +: $ 3.45076
250 +: $ 3.22071
500 +: $ 2.99066
1000 +: $ 2.93315
Stock 1000Can Ship Immediately
$ 4.69
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.74°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heatsinks are essential for the longevity of microelectronics and other delicate computer components. The ATS-02B-161-C2-R0 is an example of a highly beneficial heatsink option. It has a range of uses for the detection and removal of heat and is commonly used in a variety of applications.

Overview of the ATS-02B-161-C2-R0

The ATS-02B-161-C2-R0 is a heatsink containing an aluminum base and fins. The fins are designed to increase the surface area of the heatsink while the aluminum base provides an easily machined material to attach the fins to a specified substrate. The heatsink is available with a variety of different fin shapes and sizes, depending on the application. The largest heatsink is 19.4 x 11 mm in size.

Application Field and Working Principle of the ATS-02B-161-C2-R0

The ATS-02B-161-C2-R0 is suitable for use in a variety of applications. It is commonly used in personal computers, servers, and cell phones as well as other electronic equipment. This heatsink is especially useful in high-density circuits because it is able to dissipate heat quickly and efficiently.

The ATS-02B-161-C2-R0 works by transferring the heat generated by the components that are attached to it away from the component and into the fins of the heatsink. Once the heat has been transferred it is dissipated away from the component and into the environment. This helps to keep the component temperature within the necessary operational range and prevents damage due to overheating.

The ATS-02B-161-C2-R0 is designed to be used in a variety of ways. On the cellular phone and server applications, it can be attached to the outside of the component and used as a passive heatsink dissipates the internal heat. Alternatively, the ATS-02B-161-C2-R0 can be used as an active heatsink by adding a fan to the heatsink assembly, which will provide additional air movement across the exposed fins. This will help to maintain a more efficient and consistent cooling of the attached component.

Advantages of the ATS-02B-161-C2-R0

The ATS-02B-161-C2-R0 offers a range of benefits when used in a variety of applications. Firstly, the aluminum base of the heatsink is designed to dissipate heat quickly, allowing it to keep up with the demands of high-density circuits. Furthermore, the variety of fin types available makes the ATS-02B-161-C2-R0 suitable for a variety of applications and the addition of a fan can increase the effectiveness of the heatsink.

Another advantage of the ATS-02B-161-C2-R0 is its low-cost solution. It offers a low-cost solution to dissipating heat, allowing the user to maximize the efficiency of their systems without breaking the bank. Finally, it is a reliable option that can be used in a range of applications and climates.

Conclusion

The ATS-02B-161-C2-R0 is a highly versatile heatsink option that is suitable for use in a variety of applications. It offers a low-cost solution to dissipating heat quickly and efficiently, allowing the user to maximize their system’s efficiency. Furthermore, it is also designed to be used in a range of climates, making it a reliable option that can be used in any application.

The specific data is subject to PDF, and the above content is for reference

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