| Allicdata Part #: | ATS4507-ND |
| Manufacturer Part#: |
ATS-02B-168-C2-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02B-168-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.20040 |
| 10 +: | $ 3.11472 |
| 25 +: | $ 3.03055 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.01°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for today’s electronic systems—as sensors, processors, and power converters steadily increase their power density. Heat sinks are key components of thermal management systems, designed to dissipate heat generated by heat sources. The ATS-02B-168-C2-R0 heat sink is an advanced example of this technology, designed to operate within a wide range of operating temperatures and provide superior cooling capabilities.
The ATS-02B-168-C2-R0 is composed of an aluminum base and a copper fin array of die-cut fins. It is designed for direct mounting to flat surfaces on electronic devices. The aluminum base maintains a low profile and absorbs the heat. The copper fins are held in a vertical position so they make contact with the surface of the device, helping to draw away heat. The fins have a cross-cut pattern that increases contact and helps dissipate heat quickly. The construction of the ATS-02B-168-C2-R0 is designed to ensure maximum performance even under extreme operating conditions.
The ATS-02B-168-C2-R0 is designed for use in a wide range of applications, including processors, graphics cards, power amplifiers, RF amplifiers, automotive, consumer electronics, and other environments with high sources of heat. The heat sink is also capable of operating in a wide range of temperatures, from -55°C to +150°C. This makes it an excellent solution for a variety of applications in the extreme temperatures found in automotive and communications electronics.
The unique design of the ATS-02B-168-C2-R0 allows it to work efficiently and effectively in high-temperature environments. The aluminum base provides superior heat absorption capabilities while the copper fins draw heat away faster, helping to improve efficiency. The cross-cut pattern on the copper fins increases contact with the surface and works to dissipate heat while ensuring efficient cooling performance. The ATS-02B-168-C2-R0 is designed to operate in high-temperature environments and is capable of handling temperatures up to 150°C.
The ATS-02B-168-C2-R0 is a simple, efficient, and reliable way to reduce the risk of overheating in high-temperature environments. Its unique design makes it an excellent choice for applications in the automotive and communications industries, as well as a wide range of other applications. The thermal management capabilities provided by the ATS-02B-168-C2-R0 can improve the performance and reliability of electronic systems and keep them running cool and efficiently.
The specific data is subject to PDF, and the above content is for reference