| Allicdata Part #: | ATS-02B-17-C3-R0-ND |
| Manufacturer Part#: |
ATS-02B-17-C3-R0 |
| Price: | $ 4.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02B-17-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.80520 |
| 30 +: | $ 3.59415 |
| 50 +: | $ 3.38260 |
| 100 +: | $ 3.17123 |
| 250 +: | $ 2.95982 |
| 500 +: | $ 2.74840 |
| 1000 +: | $ 2.69555 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly important in today\'s electronic components. Heat must be managed effectively to ensure product reliability and performance. Heat sinks are a type of thermal management technology that is used to move heat away from electronic components, such as integrated circuits. ATS-02B-17-C3-R0 is a specific type of heat sink designed for use in various electronics, such as laser diodes, optic fibers, and LEDs. In this article, we will look at the application field and working principle of the ATS-02B-17-C3-R0 heat sink.
The ATS-02B-17-C3-R0 heat sink is designed for thermal management of high power components in electronic systems. It is ideal for use in applications such as laser diodes, LEDs, and other optoelectronic devices. Additionally, it is suitable for use in power electronics applications such as automotive, industrial, and medical applications. The heat sink features a finned aluminum structure with substantial heat dissipation area.
The working principle of the ATS-02B-17-C3-R0 heat sink is based on convection of heat. Heat generated by the components in an electronic system is absorbed by the fins of the ATS-02B17-C3-R0 heat sink. As the air passes over the fins, the heat is transferred to the air, thus the heat is dissipated from the components. Furthermore, the aluminum structure serves as a low thermal resistance path from the device to the surrounding air.
The ATS-02B-17-C3-R0 heat sink is designed to reduce the operating temperature of electronic components while increasing the air flow by using the fins. This allows for a stable, efficient operation of the components. Additionally, the ATS-02B-17-C3-R0 heat sink has a high thermal conductivity that ensures efficient heat transfer. The aluminum fins also provide high surface area for heat dissipation, making it an ideal choice for applications requiring higher heat transfer requirements.
The ATS-02B-17-C3-R0 heat sink is easy to install and requires minimal maintenance. It requires no additional hardware for installation and can be easily attached and removed for servicing. Additionally, the design of the heat sink is simple and it fits into many applications with ease. Furthermore, the finned aluminum structure of the heat sink is highly durable and provides reliable performance in various environmental conditions.
In conclusion, the ATS-02B-17-C3-R0 heat sink is an ideal thermal management solution for high power components in electronic systems. It features an efficient finned aluminum structure for effective heat dissipation and high thermal conductivity for a stable, efficient operation. Additionally, it is easy to install and requires minimal maintenance. Thus, it is ideal for use in laser diodes, LEDs, and other optoelectronic devices, as well as power electronics applications such as automotive, industrial, and medical applications.
The specific data is subject to PDF, and the above content is for reference