| Allicdata Part #: | ATS4515-ND |
| Manufacturer Part#: |
ATS-02B-175-C2-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-02B-175-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.57840 |
| 10 +: | $ 3.48138 |
| 25 +: | $ 3.28810 |
| 50 +: | $ 3.09481 |
| 100 +: | $ 2.90134 |
| 250 +: | $ 2.70791 |
| 500 +: | $ 2.51449 |
| 1000 +: | $ 2.46614 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
ATS-02B-175-C2-R0 is a type of aluminum heat sink commonly used in electronic applications. It is mainly used for its ability to dissipate heat from electronics, especially for high power applications. The heat sink works by conducting heat away from the electronic components and spreading it out, thus preventing overheating of the components due to excessive heat. This helps to ensure the safe operation of the electronics and also increases their lifespan.
Heat sinks work on the principle of thermal conduction. This is the process in which one material transfers heat to another material by direct contact. As heat is conducted away from the components, it is spread out over a larger area of contact. This diffuses the heat over a larger surface area and allows it to dissipate to the environment more quickly.
The surface area of ATS-02B-175-C2-R0 is increased by the aluminum fins, which provide more surface area for heat to cross through. When connected to a heat source such as an electronic device, the heat sink draws heat away from the components and diffuses it out into the ambient environment by the fins. This helps to keep the components from overheating and ensure that they remain cool and running within the manufacturer’s specifications.
ATS-02B-175-C2-R0 is also designed to be mounted onto printed circuit boards (PCBs). The heat sink is placed onto the surface of the PCB, and the fins of the heat sink come into contact with the components, dissipating heat away from them and cooling them efficiently. The heat sink can be designed with multiple mounting scenarios which provide customers with extra flexibility.
ATS-02B-175-C2-R0 is commonly used with a variety of different electronics which require cooling, including processors, video cards, power regulators, memory modules, transistors and other small components. It is also used in automotive and other applications where heat must be dissipated quickly and efficiently. The heat sink comes in a variety of sizes and shapes to accommodate different needs.
The ATS-02B-175-C2-R0 is a high-performance heat sink which is designed to provide reliable and efficient cooling for a wide range of electronics. Its ability to dissipate heat quickly and efficiently helps to preserve the lifespan of electronics, preventing damage due to overheating. Its versatile mounting options make it ideal for a variety of applications, from automotive to home electronics.
The specific data is subject to PDF, and the above content is for reference
ATS-02B-175-C2-R0 Datasheet/PDF