ATS-02B-195-C1-R0 Fans, Thermal Management |
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| Allicdata Part #: | ATS-02B-195-C1-R0-ND |
| Manufacturer Part#: |
ATS-02B-195-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02B-195-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.88°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-02B-195-C1-R0 heat sink is designed for cooling applications that require a large amount of heat dissipation. This thermoelectric heat sink uses high-efficiency aluminum fins in order to provide the maximum thermal transfer from the heat sink to the surrounding environment. It is capable of dissipating as much as 180 watts of heat, which is more than enough for most applications.
The thermal design of the ATS-02B-195-C1-R0 is based on the Air-Velocity Temperature Difference (AVTD) principle. This principle takes into account the air velocity in order to reduce the temperature difference between the hot and cold side of the heat sink and maximize thermal transfer. The heat sink is designed with multiple layers of aluminum fins that are arranged in a cross-flow pattern, providing more surface area for better heat transfer. The heat sink also features an expansive surface area, which is important for dissipating the large amount of heat produced by many devices.
The ATS-02B-195-C1-R0 is ideal for applications that require a high amount of heat transfer due to its AVTD design and expansive surface area. This makes it the ideal choice for the cooling of semiconductors, LEDs, and other electronics. It is also a great choice for heat sinks used in high-performance gaming systems, as well as cooling applications in automotive and industrial electronics.
This heat sink is designed for easy installation and requires minimal assembly. It can be mounted in a variety of ways, including screw mounting, bracket mounting, or adhesive mounting. The ATS-02B-195-C1-R0 is an efficient and reliable cooling solution for demanding applications.
In conclusion, the ATS-02B-195-C1-R0 heat sink is a high-efficiency and reliable cooling solution for applications that require a large amount of heat transfer. It is based on the AVTD principle, and its expansive surface area ensures efficient thermal transfer. The heat sink is designed for easy installation, making it perfect for a variety of industries and applications. It is the ideal choice for cooling reliable and efficient heat transfer.
The specific data is subject to PDF, and the above content is for reference