| Allicdata Part #: | ATS-02B-30-C1-R0-ND |
| Manufacturer Part#: |
ATS-02B-30-C1-R0 |
| Price: | $ 7.36 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02B-30-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.62760 |
| 30 +: | $ 6.25947 |
| 50 +: | $ 5.89138 |
| 100 +: | $ 5.52315 |
| 250 +: | $ 5.15494 |
| 500 +: | $ 4.78673 |
| 1000 +: | $ 4.69468 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-02B-30-C1-R0 is a type of thermal heat sink. It is designed to efficiently dissipate heat out of a system in order to keep its components from overheating. The ATS-02B-30-C1-R0 uses specially designed fins that allow for maximum heat transfer from an electrical device into the environment. This makes it an ideal choice for applications that generate a lot of heat such as computers, gaming consoles, power supplies, and other similar devices.
The working principle of the ATS-02B-30-C1-R0 is simple yet effective. Heat generated by the electrical device is transferred to the heat sink which disperses it into the environment via conduction. This process allows for maximum efficiency in heat dissipation and is an effective way to keep the device from becoming too hot. Heat is transferred from the component to the fins of the heat sink, and then dissipated into the environment. This process happens as air passes over the fins of the heat sink and carries the heat away from the device.
The ATS-02B-30-C1-R0 has many advantages over other types of thermal heat sinks. It has a high thermal conductivity which is much better than other materials such as aluminum and copper, making it much more efficient at dissipating heat. Additionally, its low profile design makes it ideal for cramped spaces or prototypes, as the fins of the heat sink are able to fit into tight corners. The ATS-02B-30-C1-R0 also allows for better compatibility with other components because its careful design allows for proper airflow and quick heat dissipation.
The ATS-02B-30-C1-R0 is used in many different fields due to its highly effective ability to dissipate heat. It is ideal for electrical devices where a lot of heat is generated such as computers, mobile devices, entertainment systems, gaming consoles, power supplies, and more. Additionally, it is used in automotive applications, where its low profile design and thermal efficiency makes it a great choice for managing the temperature of engine components. It is also used in a variety of industrial and scientific applications, where its high thermal capacity is able to keep sensitive components cool and safe.
The ATS-02B-30-C1-R0 is an ideal choice for thermal heat sinks, thanks to its efficient design and high thermal capacity. It is highly compatible with many different types of components and its low profile design allows it to fit into tight spaces. Additionally, it is able to dissipate heat quickly and effectively, making it an ideal choice for any application where effective heat transfer is necessary.
The specific data is subject to PDF, and the above content is for reference