| Allicdata Part #: | ATS-02B-42-C1-R0-ND |
| Manufacturer Part#: |
ATS-02B-42-C1-R0 |
| Price: | $ 6.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X22.86MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02B-42-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.82939 |
| 30 +: | $ 5.50578 |
| 50 +: | $ 5.18188 |
| 100 +: | $ 4.85806 |
| 250 +: | $ 4.53419 |
| 500 +: | $ 4.21032 |
| 1000 +: | $ 4.12935 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management in electronic applications requires a variety of components, including heat sinks. A heat sink is an accessory component used to dissipate thermal energy generated by the components in an electronic system or application. The ATS-02B-42-C1-R0 is a cost-effective and reliable heat sink with an even surface area and necessary mounting hardware, making it a great choice for a wide range of applications.
The ATS-02B-42-C1-R0 is a thermal heat sink suitable for applications in which temperature needs to be kept within certain limits. It is designed to provide an efficient and reliable cooling solution for an effective performance in the application.
The ATS-02B-42-C1-R0 is designed in a compact form and provides the necessary mounting hardware for hassle-free installation onto any motherboard. It has a small foot print and is low profile with a slim profile for easy placement in tight spaces. The heat sink has an even surface area that helps to dissipate the heat without any hot spots on the circuit board.
The ATS-02B-42-C1-R0 features a number of components that contribute to its good thermal performance. It is constructed from a high-quality aluminum alloy that is highly conductive to heat energy. The fins are designed to provide the greatest possible exposed surface area for increased heat dissipation. The heat sink has a pre-applied thermal tape to allow for enhanced heat dissipation and easy heat transfer from the device to the heat sink. Additionally, the heat sink has an integrated silicon pad to protect the device and ensure maximum compatibility with the cooling system.
The integrated thermal compound offers good thermal transfer capabilities between the device and the components of the heat sink. The thermal compound is anti-static and is designed to ensure that the thermal dissipation is at its maximum. Additionally, it also has excellent electrical insulation properties, making it suitable for high voltage applications.
The ATS-02B-42-C1-R0 works by utilizing thermal energy from the device and transferring it to the surrounding environment. The heat sink dissipates the thermal energy in the form of infrared radiation. This means that the surrounding environment absorbs the thermal energy and removes the heat from the application, thus keeping the temperature of the device within a safe range.
The ATS-02B-42-C1-R0 is the perfect choice for applications that require maximum cooling performance and energy efficiency. It is designed to provide a cost-effective and reliable cooling solution for a wide range of applications. The heat sink is well suited for applications in which the temperature needs to be kept within certain limits. Additionally, the heat sink can be used in applications where efficiency of the cooling system is a major concern.
The specific data is subject to PDF, and the above content is for reference