| Allicdata Part #: | ATS-02B-49-C3-R0-ND |
| Manufacturer Part#: |
ATS-02B-49-C3-R0 |
| Price: | $ 3.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02B-49-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.16197 |
| 30 +: | $ 3.07671 |
| 50 +: | $ 2.90581 |
| 100 +: | $ 2.73489 |
| 250 +: | $ 2.56397 |
| 500 +: | $ 2.47851 |
| 1000 +: | $ 2.22211 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are one of the most important components in the thermal management of a system. They are used to capture and dissipate heat away from components, and can help to maintain optimal temperatures that are safe and reliable for the system\'s components.
The ATS-02B-49-C3-R0 is one type of heat sink used for thermal management of a system. It is a compact, lightweight, aluminum alloy heat sink that can be easily mounted onto a printed circuit board (PCB). The heat sink features a highly efficient finned design that helps to dissipate heat by transferring it away from the component to the external environment.
The ATS-02B-49-C3-R0 heat sink is suitable for use with integrated circuit (IC) chips, high-power transistors, and optical devices. The device is also designed to be used in power converters, voltage regulators, and other thermal management applications. As these components require a high level of heat dissipation, the ATS-02B-49-C3-R0 device is an ideal solution.
The ATS-02B-49-C3-R0 heat sink has a fin stack of 49 pieces that is constructed from aluminum alloy. This finned stack provides an effective way to transfer heat away from the device and into the environment. The fins are designed to capture and dissipate heat away from the components that are mounted onto the PCB. The device also features an anodized black finish that helps to reduce corrosion.
The ATS-02B-49-C3-R0 heat sink is compact and lightweight, which makes it suitable for use in various applications. The device features mounting holes that enable easy mounting onto a PCB. It also features a lead free, RoHS compliant production process for greater environmental sustainability.
The ATS-02B-49-C3-R0 heat sink has a working temperature range of -20°C to +100°C. The device also has a thermal resistance of 0.374 K/W. This device is designed to handle high levels of heat and can dissipate heat quickly and effectively without compromising performance or reliability.
Overall, the ATS-02B-49-C3-R0 heat sink is an ideal choice for thermal management applications. The device is suitable for use with Integrated Circuit (IC) chips, high-power transistors, and optical devices. The finned stack, combined with the anodized black finish, enables effective heat transfer away from the components. Furthermore, the device is compact and lightweight, enabling it to be used in various applications. The device has a working temperature range of -20°C to +100°C and a thermal resistance of 0.374 K/W, making it suitable for high temperature and high power applications.
The specific data is subject to PDF, and the above content is for reference