ATS-02B-60-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.33°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-02B-60-C1-R0 is a thermal - heat sink technology designed for high efficiency applications. It is used to dissipate heat created by electronic components and protect them from damage. This technology is designed to provide the best heat transfer performance, making it an ideal solution for applications where space is limited.

ATS-02B-60-C1-R0 Application Field

The ATS-02B-60-C1-R0 is typically used in the automotive industry where heat dissipation is needed to improve the performance of electronic components. This technology can also be found in telecom applications, industrial automation, medical and other high-tech fields. It is widely used in data centers and server rooms, providing critical cooling and protection for sensitive equipment.

ATS-02B-60-C1-R0 Working Principle

The ATS-02B-60-C1-R0 utilizes a high-efficiency cooling technology that effectively transfers heat away from components. The principle of this technology is based on the thermodynamic principle of conduction heat transfer. Heat generated by components is conducted away and diffused through the aluminum fins of the ATS-02B-60-C1-R0. This helps reduce the temperature in the surrounding environment and keeps components from overheating.The unique design of the ATS-02B-60-C1-R0 also helps to maintain air flow around components, allowing for enhanced dissipation of heat and improved efficiency. Additionally, the technology is designed to be self-regulating, minimizing maintenance and downtime.

Conclusion

The ATS-02B-60-C1-R0 is an advanced thermal - heat sink technology designed to effectively dissipate heat and protect sensitive components from damage. It utilizes a high-efficiency cooling technology based on the thermodynamic principle of conduction. This technology is widely used in automotive, telecom, industrial automation, medical, data centers and more. It is an ideal solution for applications where space is limited and provides powerful cooling and protection for sensitive components.

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