ATS-02B-70-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.79°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Heat sinks are important components of modern electronics that help to dissipate generated heat away from sensitive components. Examples of important heat sink applications include semiconductors, power electronics, and other thermal components that require proper thermal management. The ATS-02B-70-C3-R0 is a specific heat sink model often used in a variety of industries. This article explains the application field and working principle of the ATS-02B-70-C3-R0 heat sink in detail.

Application Field

The ATS-02B-70-C3-R0 is a compact heat sink with advanced features, including a copper base and an aluminum frame. It is designed for use in a variety of field applications including power electronics, consumer electronics, communication devices, and other high-end electronic products such as laptops, tablets, and TVs. Its compact size allows for easy integration, making it suitable for embedded designs. This heat sink is also available in a variety of sizes ranging from 50mm to 200mm, which helps to customize the heat dissipating capacity according to the application requirement.

Working Principle

The ATS-02B-70-C3-R0 is a two-stage thermal solution, comprising an aluminum frame and a base made of copper. The aluminum frame serves as a heatspreader. It helps in the distribution of heat by dissipating the heat quickly while maintaining a low thermal resistance. The copper base further helps to dissipate the heat away from the heat source, thus reducing the risk of overheating. Additionally, the copper base also helps to increase the heat dissipating capacity of the ATS-02B-70-C3-R0 heat sink, thereby helping to lower the temperature of the heat source.Besides heat dissipation, the ATS-02B-70-C3-R0 also provides thermal insulation. The aluminum frame is filled with air that helps to reduce the amount of heat transferred from the heat source to the heat sink. Additionally, the copper base helps to reduce the temperature gradient between the heat source and the heat sink, thereby improving the overall thermal performance of the heat sink.Finally, the ATS-02B-70-C3-R0 also comes with an attached cooling fan. The fan helps to further reduce the temperature of the heat sink by circulating cool air around the heat source. This helps to keep the heat source running at its optimal temperature, thus extending its service life.

Conclusion

The ATS-02B-70-C3-R0 heat sink is a compact and reliable output solution for a variety of applications. It is a two-stage thermal solution with a copper base and an aluminum frame that helps to quickly dissipate heat away from the heat source while providing thermal insulation. Additionally, it comes with an attached cooling fan that helps to further reduce the temperature of the heat sink. All these features make the ATS-02B-70-C3-R0 an excellent heat sink for modern electronics.

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