ATS-02C-10-C3-R0

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Heat sinks are devices used to lower the temperature of a device, such as an electronic component, by dissipating heat through passive conduction with the help of an external air or liquid flow. The thermal interface material (TIM) provides the connection between the heat sink and the heat-generating component. The use of a heat sink introduces a counterflow of heat in the internal circuitry of the device, leading to an overall decrease in the internal temperature of the device. The ATS-02C-10-C3-R0 is a type of heat sink, designed for use in small-size communication devices that require efficient thermal management.

The ATS-02C-10-C3-R0 heat sink does not require a fan, which keeps the power consumption of the device low and noise levels to a minimum. It is a low profile heat sink with a height of only 6mm, suitable for compact devices with limited mounting space. The aluminum alloy construction of the heat sink provides high thermal conductivity, excellent heat dissipation and stable performance even at high temperatures.

The ATS-02C-10-C3-R0 is designed to be used with the thermal interface material (TIM) of your choice, providing maximum flexibility when designing your system. An electrically insulated thermal pad is supplied with the heat sink, ensuring effective electrical isolation between the heat sink and the component. The thermally conductive adhesive tape can ensure good contact between the heat sink and the component.

The ATS-02C-10-C3-R0 heat sink is suitable for various industrial applications, such as automotive, medical and datacom, as a result of its small size, heat dissipation and low power consumption. In addition, due to its wide temperature range and excellent thermal performance, it can also be used for spacecraft and satellite applications. This heat sink also offers a wide range of mounting options, such as spring clips, screws and clips for easy installation.

The ATS-02C-10-C3-R0 is designed to work with a wide variety of thermal interface materials, such as air gap filler pads, electrically conductive adhesives, heat spreading tapes and thermal gap fillers. It is important to use a suitable thermal interface material (TIM) according to the device’s application requirements and the operating environment. This allows the heat sink to function efficiently and provide the maximum heat dissipation rate.

The ATS-02C-10-C3-R0 has a maximum compressive force of 2 N/mm and offers a broad range of thermal resistance at ambient temperatures from -40°C to +85°C. This heat sink\'s performance is highly reliable even under varying environmental conditions, and it is capable of dissipating heat from a wide range of component sizes. The ATS-02C-10-C3-R0 is designed to be used in a variety of applications, such as computer motherboards, device system boards, fanless video cards and small HPC solutions.

The ATS-02C-10-C3-R0 heat sink provides efficient thermal management for a wide range of components. By using an appropriate thermal interface material, it is able to dissipate the heat generated by electronics quickly and reliably. This makes the ATS-02C-10-C3-R0 an ideal choice for applications in which efficient thermal management is essential for optimum performance. It is compact, reliable and cost-effective, making it a great choice for thermal management solutions.

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