| Allicdata Part #: | ATS-02C-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-02C-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02C-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat-sinks play a vital role in cooling electronic components and ATS-02C-117-C1-R0 is no exception. It is a type of Thermal Heat Sink designed to dissipate heat generated by electronic components such as processors, memory chips and voltage regulators. There are few factors that have to be considered when selecting the proper heat sink for any application, and the ATS-02C-117-C1-R0 seeks to address all of them.
First and foremost, the ATS-02C-117-C1-R0 is equipped with a small fan for cooling purposes. This allows for a more efficient cooling process, as the fan directs air over the component more directly than a passive heat sink. The fan is also relatively quiet, providing efficient cooling without producing an intrusive noise.
The ATS-02C-117-C1-R0 also features an innovative design that allows it to adapt to many different component shapes and sizes. This is achieved through its unique modular design, which allows for the attachment of additional fins and other components to create a custom heat sink that is perfect for the application at hand. This feature makes the ATS-02C-117-C1-R0 a great choice for applications where component shape and size can vary.
Finally, the ATS-02C-117-C1-R0 is designed for use in high-temperature applications. Its construction features aluminum fins and a copper base that dissipate heat more quickly and efficiently, allowing components to remain cool even when exposed to high temperatures. The heat sink also features an additional layer of PTFE coating, which reduces the possibility of corrosion and improves its overall durability.
The ATS-02C-117-C1-R0\'s remarkable combination of features make it an appealing choice for many applications. Its efficient cooling capabilities, adaptable design, and durability allow it to be used in a variety of thermal management applications. It is perfect for cooling components in high-temperature environments, as well as for cooling smaller components where space may be an issue. Additionally, its modular design makes it easy to customize for any application.
In conclusion, the ATS-02C-117-C1-R0 is an effective and efficient thermal heat sink ideal for many applications. Its combination of features makes it an excellent choice for keeping electronic components cool and running smoothly, even in high-temperature environments. Whether you need to cool processors, memory chips, or other components, the ATS-02C-117-C1-R0 is an ideal solution.
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