| Allicdata Part #: | ATS-02C-12-C3-R0-ND |
| Manufacturer Part#: |
ATS-02C-12-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02C-12-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has been a long standing challenge, especially in applications where high powered electronics are generating significant heat and must maintain an optimal temperature for intricate circuitry. Heat sinks are a key component for efficient heat dissipation and the ATS-02C-12-C3-R0 is an advanced heat sink designed for a wide range of applications. This article will discuss the application field and working principle of the ATS-02C-12-C3-R0 heat sink.
The ATS-02C-12-C3-R0 heat sink has been designed with a number of features that make it suitable for a wide range of applications. It is capable of dissipating up to 500 watts of heat in an environment with limited air flow. This allows it to be used in complex machinery, medical devices, and industrial automation systems. Its anodized aluminum construction makes it highly durable and resistant to corrosion and/or oxidation. Additionally, its slim design and easy installation helps to minimize the overall size and weight of the application.
Its unique design and construction allows efficient heat dissipation. The heat sink is composed of a series of finned heatpipes that act as heat exchangers and transfer heat away from the substrate or components in high thermal loads to other areas. By using a combination of high air velocity and low air pressure, the heat sink is capable of dissipating its own body heat as well as radiating absorbed thermal energy from components. The heat sink also features a direct-contact configuration with a thermal interface material to further improve the heat transfer capability.
The ATS-02C-12-C3-R0 is designed to be used with two fans of equal size and speed to ensure maximum heat dissipation and airflow. The fans are spaced apart along the heat exchanger\'s width, allowing for greater surface area coverage. This ensures that the entire heat sink surface area is cooled evenly and contributes to the overall cooling efficiency. Additionally, the fan speed and airflow can be adjusted to meet the specific requirements of the application. This allows the heat sink to be used in both strict temperature regimes and more relaxed thermal operating environments.
In summary, the ATS-02C-12-C3-R0 is an advanced heat sink that is capable of dissipating up to 500 watts of heat in a wide range of applications. Its unique design and construction allow for efficient heat dissipation and its slim design helps to minimize the size and weight of the application. It is composed of a series of finned heatpipes and features a direct-contact configuration with a thermal interface material. It is designed to be used with two fans of equal size and speed in order to ensure maximum heat dissipation and airflow. With its wide range of features, the ATS-02C-12-C3-R0 is an ideal solution for efficient thermal management.
The specific data is subject to PDF, and the above content is for reference