
Allicdata Part #: | ATS-02C-126-C1-R0-ND |
Manufacturer Part#: |
ATS-02C-126-C1-R0 |
Price: | $ 3.51 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 54X54X15MM XCUT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.18591 |
30 +: | $ 3.09981 |
50 +: | $ 2.92774 |
100 +: | $ 2.75549 |
250 +: | $ 2.58325 |
500 +: | $ 2.49714 |
1000 +: | $ 2.23882 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.126" (54.01mm) |
Width: | 2.126" (54.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.590" (15.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 5.45°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Thermal or heat sinks are a form of heat dissipating device. They are used in a variety of applications, from computers to industrial machinery. The ATS-02C-126-C1-R0 is a thermal heat sink specifically designed for industrial and computing applications. In this article, we will look at the application field and working principle of the ATS-02C-126-C1-R0.
Applications
The ATS-02C-126-C1-R0 heat sink is designed for both industrial and computing applications. In industrial settings, the heat sink can be used in various production and manufacturing operations. It can be used to cool motors, pumps, transformers, and other high-powered mechanical components. In computer systems, it can be used for cooling the CPU, graphics cards, and other high-heat components. In either application, the ATS-02C-126-C1-R0 ensures efficient and reliable performance.
Design and construction
The ATS-02C-126-C1-R0 is constructed from anodized aluminum extrusion. This provides a high level of corrosion and heat resistance, ensuring a long service life. The design also features a finned array that extends the surface area of the heat sink, which increases the rate of heat dissipating from the device. The construction also includes a patented air-guiding system that quickly and efficiently draws the heat away from the source.
Thermal performance
The ATS-02C-126-C1-R0 provides a high thermal performance, allowing it to handle a wide range of temperatures. The device can operate at temperatures up to 120°C, while maintaining a low profile and efficient heat dissipation. In addition, the device provides a superior heat transfer rate, which ensures that the device can keep up with the demanding temperature demands of industrial and computer applications. The device also provides a high static pressure, allowing it to be used in tight spaces without sacrificing performance.
Working principle
The ATS-02C-126-C1-R0 utilizes a simple yet effective working principle. When the heat is generated by a device, the heat sink absorbs this heat and dissipates it away from the device. This is done through the finned array of the heat sink. The fins act as a buffer, allowing for the heat to be drawn away from the device more easily. This allows for the device to stay operational for longer periods of time, providing a reliable performance.
In addition to this, the air-guiding system helps to ensure that the heat is drawn away from the device more efficiently. This system helps to draw off the warm air that is generated and expels it away, ensuring that the temperature of the device is regulated and kept at a stable level.
Conclusion
The ATS-02C-126-C1-R0 thermal heat sink is an effective device for both industrial and computing applications. With its high thermal performance and superior construction, the device ensures a reliable and efficient performance. The working principle of the device also makes it easy to use, allowing it to be implemented in any type of application. With its various features, the ATS-02C-126-C1-R0 is a great choice for those looking for an effective thermal solution.
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