| Allicdata Part #: | ATS-02C-146-C3-R0-ND |
| Manufacturer Part#: |
ATS-02C-146-C3-R0 |
| Price: | $ 3.89 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02C-146-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.53934 |
| 30 +: | $ 3.34278 |
| 50 +: | $ 3.14622 |
| 100 +: | $ 2.94953 |
| 250 +: | $ 2.75290 |
| 500 +: | $ 2.55626 |
| 1000 +: | $ 2.50711 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important part of the operation of any electronic device. A thermal management system must be able to provide enough heat dissipation to prevent devices from overheating and suffering damage. Thermal management solutions can range from simple air cooling to complex liquid cooling and refrigeration systems. One of the most common thermal management solutions is the application of heat sinks, which are designed to dissipate heat from a device to the surrounding environment. For this purpose, ATS-02C-146-C3-R0 is a leading heat sink solution.
The ATS-02C-146-C3-R0 heat sink is created with Enthone Alloy C-146-C3-R0, which is an aluminum-silicon-zinc alloy. The alloy provides superior thermal conductivity, allowing for better heat dissipation capabilities than other common alloys. Additionally, the alloy offers superior corrosion protection compared to pure aluminum, which ensures that it is suitable for a range of applications, even in highly corrosive environments. The ATS-02C-146-C3-R0 is designed to be easy to install and contains four screws for mounting. The design of the heat sink also includes large fins, which increase the surface area of the device for enhanced heat dissipation.
The primary working principle of ATS-02C-146-C3-R0 is finned heat sink convection. When the heat sink is installed correctly, it will capture thermal energy from the components on the circuit board and transfer it to the air surrounding it. As the air is warmed by the heat sink, convection will cause the warmed air to rise and cooler air to take its place. This process will continue as long as the device is powered, allowing for continuous heat dissipation.
The ATS-02C-146-C3-R0 can be applied to a range of applications, including computers, digital broadcast systems, LED lighting, and security cameras. The heat sink is designed to be lightweight and durable, and can be adjusted to fit any application. Additionally, this heat sink features anti-mosquito guard mesh, which prevents dust and other debris from clogging the fins and limiting heat dissipation.
In conclusion, the ATS-02C-146-C3-R0 heat sink is an effective thermal management solution, offering superior thermal conductivity, corrosion protection, and lightweight and durable construction. The alloy used in its construction is well-suited for a range of applications, while its finned design effectively utilizes convection to dissipate heat from components onto the environment. The ATS-02C-146-C3-R0 is therefore a versatile and reliable heat sink solution that is suitable for a variety of thermal management needs.
The specific data is subject to PDF, and the above content is for reference