| Allicdata Part #: | ATS-02C-157-C3-R0-ND |
| Manufacturer Part#: |
ATS-02C-157-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02C-157-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are widely used in various electronics circuits and products. They are often used to dissipate excess heat produced by processor or other electronic components，and keep the temperature of the devices in the safe range. ATS-02C157-C3-R0 is a kind of heat sink commonly used to dissipate the heat generated by electronic components.
ATS-02C-157-C3-R0, a thermal-heat sink with a size of 15.7*15.7*7.3mm, can transfer the generated heat to the surrounding air and reduce the temperature of the components. The heat sink is constructed with copper and aluminum materials, which has an excellent thermal conductivity and relatively lightweight。
When designing the heat sink, multi-level triple-fin structure is applied, which increases the cooling area. In addition, the surface of heat sink is designed to a fan pattern with precise dimensions, to increase the power efficiency. By dissipating the heat through this triple fan cooling structure, it promises a better heat dissipation performance than other thermal-heat sinks in the market.
The ATS-02C-157-C3-R0 works when the temperature of components exceeds the critical point. The fan starts to spin at a certain speed and it pushes the air passing through it towards the aluminum heat sink, producing a cooling effect. Hot air is forced to pass through the heat sink as a result, and the heat of the electronics components is absorbed by the heat sink and then dissipates to the surrounding air, thus reducing the temperature of the components.
The ATS-02C-157-C3-R0 is a perfect choice for customers who need lower power consumption and higher power efficiency. It is easy to install, it has a fan design which ensures low noise and high performance. It uses copper and aluminum materials which are moderate in price and delivers excellent thermal conductivity which enhances its performance. With its triple fan structure, the ATS-02C-157-C3-R0 can dissipate large amounts of heat and keep the temperature of the components in the safe range.
The specific data is subject to PDF, and the above content is for reference