ATS-02C-175-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	13.48°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are devices that are used to protect electronic components from becoming overheated due to extended exposure to high temperatures. Heat Sinks are especially important when using power transistors, such as theATS-02C-175-C1-R0, which can become severely damaged if not protected from high temperatures. This article will discuss the application field and working principle of the ATS-02C-175-C1-R0 heat sink in order to better understand how it can protect electronic components from becoming damaged from high temperatures.

Application Field

Heat sinks are used in a variety of applications, including power supplies, audio systems, electronic instruments, medical equipment, and even in consumer electronics products. They are most commonly used to protect sensitive electrical components such as microprocessors, transistors, and integrated circuits from becoming damaged due to prolonged exposure to high temperatures. The ATS-02C-175-C1-R0 is a heat sink that has been specifically designed to be used with the ATS-02C-175 power transistor, which is a high power device that can easily become damaged due to high temperatures.

Working Principle

Heat sinks work by dissipating heat away from electronic components and directing it to the surrounding air. This is done through the use of a metal body, which is typically made from aluminum, that is designed to have a large amount of surface area. When the heat sink is installed over a power transistor such as the ATS-02C-175-C1-R0, the body absorbs the heat generated by the component and radiates it out into the surrounding air. This allows for the power transistor to operate at a lower temperature, which protects the device from being damaged.In addition to the metal body, the ATS-02C-175-C1-R0 also contains fins that are designed to increase the surface area of the heat sink. These fins allow for more air to be circulated around the heat sink, which further increases its ability to dissipate heat. Additionally, the fins may contain angled surfaces that act as guides, causing the air that is circulated to move in a specific direction. This helps to increase the effectiveness of the heat sink by directing the air around it in the most efficient manner.

Conclusion

The ATS-02C-175-C1-R0 is an effective heat sink designed specifically for use with the ATS-02C-175 power transistor. It contains a metal body that absorbs heat from the component and radiates it out to the surrounding air, as well as fins that increase the heat sink’s surface area and help to direct the air in a specific direction. This helps to protect the power transistor from being damaged due to prolonged exposure to high temperatures by managing its temperature more efficiently.

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