| Allicdata Part #: | ATS-02C-175-C3-R0-ND |
| Manufacturer Part#: |
ATS-02C-175-C3-R0 |
| Price: | $ 3.78 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02C-175-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.43539 |
| 30 +: | $ 3.34278 |
| 50 +: | $ 3.15706 |
| 100 +: | $ 2.97140 |
| 250 +: | $ 2.78568 |
| 500 +: | $ 2.69282 |
| 1000 +: | $ 2.41425 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.65°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions come in a variety of forms, but one of the most popular is the use of heat sinks. Heat sinks play an important role in dissipating heat from components, often critical components. The ATS-02C-175-C3-R0 is a specific heat sink that is ideal for applications in which large amounts of heat must be dissipated. To better understand the ATS-02C-175-C3-R0’s application field and working principle, this article will explain its features and components, its overall design, and its operating principles.
The ATS-02C-175-C3-R0 is made up of a baseplate, a baseplate recess, a standoff heat sink, and a heat sink clamp. The baseplate is made of aluminum alloy and is tailored to the component’s thermal properties so as to dissipate heat efficiently. The baseplate recess is a raised area designed to accommodate the standoff heat sink. The standoff heat sink is made of aluminum extrusion and is engineered to dissipate up to 75 watts of power. Finally, the heat sink clamp is designed to clamp the other components securely to the baseplate.
The overall design of the ATS-02C-175-C3-R0 is optimized to maximize its heat dissipation capabilities. The radiative fins maximize the heat sink’s surface area so that more heat can be dissipated from the fins. The fins are connected to the baseplate with a unique groove structure that creates a thermal bridge to efficiently transfer heat away from the component and into the fins. The groove also ensures that the fins maintain an even temperature. Finally, the fins are anodized to increase their ability to dissipate heat.
The ATS-02C-175-C3-R0’s operating principle is simple and effective. The heat sink draws heat from the component via the baseplate. The heat is then transferred to the fins via the groove structure. The heat dissipates from the fins, which also helps to cool the component. This cycle is repeated until the desired temperature is achieved.
The ATS-02C-175-C3-R0 is an effective heat sink solution for applications that require large amounts of heat dissipation. Its design is optimized to provide maximum heat dissipation and its operating principle is simple yet effective. By understanding the ATS-02C-175-C3-R0’s features and components, its overall design, and its operating principle, engineers can be sure that they are selecting the best heat sink solution for their needs.
The specific data is subject to PDF, and the above content is for reference