ATS-02C-178-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS4716-ND

Manufacturer Part#:

ATS-02C-178-C2-R0

Price: $ 4.21
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X25MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02C-178-C2-R0 datasheetATS-02C-178-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.83040
10 +: $ 3.72456
25 +: $ 3.51767
50 +: $ 3.31065
100 +: $ 3.10376
250 +: $ 2.89684
500 +: $ 2.68992
1000 +: $ 2.63820
Stock 1000Can Ship Immediately
$ 4.21
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.82°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Heat sinks are essential components in any large, complex system. They are responsible for keeping temperatures within acceptable ranges. This helps protect sensitive internal components from extreme temperatures that can damage or destroy them. ATS-02C-178-C2-R0 is a common type of heat sink, used in a variety of applications. This article will discuss the various applications of ATS-02C-178-C2-R0 and the working principle behind its effective performance.

The ATS-02C-178-C2-R0 is an axial heat sink designed for high-temperature applications. It is made from aluminum which is an excellent thermal conductor. One of its most common applications is in high-performance CPUs, which require a large amount of cooling to function efficiently. In order to ensure that heat is moved away from the component being cooled quickly, the heat sink is designed with narrow channels of high-conductivity material that increase the exposed surface area. The increased surface area allows more heat to be conductively transferred away from the component being cooled quickly and efficiently.

Another common application of the ATS-02C-178-C2-R0 is in computer fan systems. The heat sink is placed between the fan blades and the component being cooled, helping to quickly dissipate heat. It is also used in automotive applications where components are exposed to harsh environments or large amounts of heat from exhaust systems. In many cases, an ATS-02C-178-C2-R0 is used to dissipate heat more quickly from components in order to keep them operating optimally.

The ATS-02C-178-C2-R0 is also used for other applications such as inside electronics enclosures and dissipating heat away from enclosures. The heat sink has a higher surface area than traditional heat sinks, allowing it to more effectively dissipate heat while still maintaining integrity. Heat is dissipated away from the component quickly, allowing it to remain cool and operate normally. It is also used in the manufacture of many consumer electronics, such as televisions, laptops, and smartphones. The increased surface area helps to keep the device cool and running efficiently.

The working principle of the ATS-02C-178-C2-R0 is relatively simple. When a device with an ATS-02C-178-C2-R0 heat sink is activated, the heat is dissipated from the components to the air faster than the other components in the device heat sink. This helps to reduce the temperature of the other components, helping it to operate optimally. The heat sink also helps to transfer heat away from the hot components and spread it out evenly, further increasing the cooling efficiency.

In conclusion, the ATS-02C-178-C2-R0 is a specialized type of thermal heat sink that has a wide variety of applications. It is used to dissipate heat quickly and efficiently from components, allowing them to remain cooler and operate optimally. It utilizes an aluminum material which is a great thermal conductor and has higher exposed surface area for increased cooling efficiency. The working principle is also relatively simple: heat is transferred away from hot components quickly, allowing them to remain cool and perform optimally.

The specific data is subject to PDF, and the above content is for reference

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