ATS-02C-19-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-02C-19-C1-R0-ND

Manufacturer Part#:

ATS-02C-19-C1-R0

Price: $ 3.79
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X20MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02C-19-C1-R0 datasheetATS-02C-19-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.44673
30 +: $ 3.25542
50 +: $ 3.06394
100 +: $ 2.87242
250 +: $ 2.68093
500 +: $ 2.48943
1000 +: $ 2.44156
Stock 1000Can Ship Immediately
$ 3.79
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.75°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

As a part of the Thermal Solutions portfolio of cooling solutions, ATS-02C-19-C1-R0 heat sink is especially designed to provide essential cooling for hot-running electronic components, offering a robust solution for heat dissipation at an economical price. This heat sink finds its application in a variety of industries, from natural gas and oil to automotive and medical. It can be used for applications in which the temperature of the component to be cooled has to be kept within operating limits; this includes components such as regulators, motors, and processors.

The ATS-02C-19-C1-R0 heat sink is constructed using an aluminum heat exchanger. This design helps in effectively dissipating thermal energy away from hot spots on the component. The fins of the aluminum heat exchanger provide a large surface area that dissipates heat quickly and efficiently. The fins are configured to maximize heat transfer, which helps to maintain proper temperature conditions for the components being cooled.

In practicality, the design of the heat sink facilitates an efficient heat flow by dissipating heat from the hot spots on the component. The shape of the fins is engineered to increase surface area and encourage maximum heat dissipation. Air flow is also taken into account when designing fins; the greater the flow of air, the greater the heat dissipation. Additionally, an integrated fan is often added near the heat sink to cool the component and help ensure efficient heat dispersion.

When it comes to installation, the ATS-02C-19-C1-R0 heat sink is easily mounted onto the component without the need for special tools. It also comes with predrilled holes for easy installation. The heat sink is equipped with thermal grease that helps to promote better heat conduction. This helps in ensuring that the components run their maximum performance without being limited by the heat sink.

The use of the ATS-02C-19-C1-R0 heat sink is especially suited for hot components that are prone to overheating, specifically those which require stable temperature conditions for proper operation. For instance, it is often used in the industrial sector for cooling high-powered motors and processors. It is also used in the automotive and medical sectors. The heat sink also proves to be an effective way of cooling down components that are required to operate continuously.

In conclusion, the ATS-02C-19-C1-R0 heat sink is an efficient and cost-effective solution for cooling hot electronic components. Its aluminum heat exchanger and pre-drilled mounting holes make installation and maintenance easy and straightforward. Its fins are designed to maximize heat dissipation and help ensure that the components remain within required operating temperatures. This thermal solution is used in industries like natural gas and oil, automotive, and medical, and it is especially useful for components that require continuous operation.

The specific data is subject to PDF, and the above content is for reference

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