| Allicdata Part #: | ATS4735-ND |
| Manufacturer Part#: |
ATS-02C-195-C2-R0 |
| Price: | $ 3.58 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02C-195-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.25710 |
| 10 +: | $ 3.17394 |
| 25 +: | $ 3.08826 |
| 50 +: | $ 2.91677 |
| 100 +: | $ 2.74516 |
| 250 +: | $ 2.57363 |
| 500 +: | $ 2.48783 |
| 1000 +: | $ 2.23047 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal conductivity is an essential factor in any device which requires heat dissipation. Heat sinks are a common form of thermal management, designed to absorb and dissipate heat away from vital electronic components, such as CPUs and GPUs in computers or even circuit boards in industrial equipment. The ATS-02C-195-C2-R0 is a special type of heat sink designed to maximize the dissipation of heat from electrical components.
The ATS-02C-195-C2-R0 uses a combination of aluminum and copper materials to spread the heat quickly and evenly away from the component. Aluminum is an excellent thermal conductor, and when combined with copper, the thermal conductivity of the material increases significantly, as copper has even higher thermal conductivity than aluminum. This combination of materials ensures that even the most powerful components draw heat away from them quickly and efficiently.
The ATS-02C-195-C2-R0 also comes with a variety of features that make it particularly suited for certain applications. Firstly, it is very lightweight, so it can be used in applications that have weight restrictions. It also has a low profile design, so it can fit into components with limited space. Additionally, the heat sink has an anodized aluminum surface, which makes it resistant to abrasion and corrosion.
The ATS-02C-195-C2-R0 is mainly used in applications where consistent and efficient heat dissipation is necessary. This includes computers, workstations, servers, industrial equipment, and embedded systems. Typically, the heat sink will be attached to the component with a thermal pad or thermal grease, and the component will be clamped in place with a mounting bracket. This ensures that the heat sink is securely mounted to the component, and that the full benefit of its thermal conductivity can be taken advantage of.
When in use, the ATS-02C-195-C2-R0 pulls heat away from the component and sends it through its fin array. The fin array disperses the heat quickly and efficiently, drawing it away from the component and allowing it to dissipate into the surrounding environment. The fin array increases the heat sink’s surface area, allowing it to transfer more heat away from the component in a short time frame.
The ATS-02C-195-C2-R0 is an advanced heat sink designed for efficient and reliable thermal management of electronic components. Its combination of aluminum and copper materials make it highly effective at dissipating heat, while its low profile and anodized aluminum surface make it particularly suited for space-sensitive applications. Its fin array ensures that the heat is dissipated quickly and efficiently to keep components running cool and stable.
The specific data is subject to PDF, and the above content is for reference