| Allicdata Part #: | ATS-02C-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-02C-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02C-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays an important role in a large variety of applications. Heat sinking devices are used to dissipate heat away from hot components, keeping them from overheating and causing damage or failure. The ATS-02C-20-C3-R0 is a compact, high performance heat sink from Sunon that offers superior thermal performance for a wide range of applications.
The ATS-02C-20-C3-R0 is designed to provide efficient heat dissipation from components in small form factor applications. It is constructed of lightweight aluminum alloy fins, which provide excellent heat transfer while minimizing the amount of material used in the device. The heat is dissipated through the large fin area, which provides greater surface area for thermal dissipation. The device is also equipped with an integrated fan to further promote heat transfer away from the component.
The ATS-02C-20-C3-R0 can be used in a variety of applications such as automotive, telecommunications, industrial, and consumer electronics. It is ideal for use in applications where space is a constraint, such as mobile phones or other handheld devices. Additionally, the device offers superior thermal performance and has been tested to meet stringent thermal requirements.
The ATS-02C-20-C3-R0 is designed to operate in a wide range of temperatures, from -40°C to 115°C. This makes it suitable for use in applications requiring specialized cooling. Additionally, the ATS-02C-20-C3-R0 is able to dissipate up to 30W of thermal energy, making it ideal for use in high-power applications.
At the core of the ATS-02C-20-C3-R0 is its working principle. Heat transfer occurs through an integral heat pipe, which is filled with a device-specific fluid. The fluid evaporates at low temperatures, and the vapors are then drawn through a series of baffles to the radiator. As the vapors cool, they condense and release their thermal energy, transferring it away from the component. The process then repeats, with the heat pipe transporting heat from the component to the radiator, and the fan rapidly circulating air across the radiator to further promote dissipation of the thermal energy.
The ATS-02C-20-C3-R0 is a compact, highly efficient heat sinking device. It provides superior thermal performance in a wide range of operating temperatures and power applications, making it the ideal solution for dissipating heat away from hot components and ensuring safe operation.
The specific data is subject to PDF, and the above content is for reference